The invention relates to a highly heat conductive valve seat ring (1) comprising a carrier layer (2) and a functional layer (3), wherein the carrier layer (2) consists of a solidified copper matrix containing 0.10 to 20% w/w of a solidifying component s and the functional layer (3) consists of a solidified copper matrix which further contains, based on the copper matrix, 5 to 35% w/w of one or more hard phases.