公开(公告)号：US20140124940A1

公开(公告)日：2014-05-08

申请号：US13713407

申请日：2012-12-13

Applicant: BROADCOM CORPORATION

Inventor： Milind S. Bhagavat ,  Javed Iqbal Sandhu ,  Rezaur Rahman Khan ,  Teck Yang Tan

IPC: H01L23/485 ,  H01L21/768

CPC classification number: H01L23/147 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/49827 ,  H01L23/525 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/02335 ,  H01L2224/02375 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05568 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2224/05552

Abstract: Methods, systems, and apparatuses for semiconductor devices are provided herein. A semiconductor device includes an array of conductive pads for signals. One or more non-linear compliant springs may be present to route signals from the conductive pads to interconnect pads formed on the semiconductor device to attach bump interconnects. Each non-linear compliant spring may include one or more routing segments. The semiconductor device may be mounted to a circuit board by the bump interconnects. When the semiconductor device operates, heat may be generated by the semiconductor device, causing thermal expansion by the semiconductor device and the circuit board. The semiconductor device and circuit board may expand by different amounts due to differences in their thermal coefficients of expansion. The non-linear compliant springs provide for compliance between the conductive pads and bump interconnects to allow for the different rates of expansion.

Abstract translation: 本文提供了用于半导体器件的方法，系统和装置。 半导体器件包括用于信号的导电焊盘阵列。 可以存在一个或多个非线性柔性弹簧以将信号从导电焊盘传送到在半导体器件上形成的互连焊盘以附接凸起互连。 每个非线性顺应弹簧可以包括一个或多个路线段。 半导体器件可以通过凸块互连来安装到电路板。 当半导体器件工作时，可能由半导体器件产生热量，引起半导体器件和电路板的热膨胀。 由于其热膨胀系数的差异，半导体器件和电路板可以扩展不同的量。 非线性柔性弹簧提供导电焊盘和凸块互连之间的顺应性，以允许不同的膨胀率。

公开(公告)号：US09287189B2

公开(公告)日：2016-03-15

申请号：US13713407

申请日：2012-12-13

Applicant: Broadcom Corporation

Inventor： Milind S. Bhagavat ,  Javed Iqbal Sandhu ,  Rezaur Rahman Khan ,  Teck Yang Tan

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/525 ,  H01L23/528 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/147 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/49827 ,  H01L23/525 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/02335 ,  H01L2224/02375 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05568 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2224/05552

Abstract: Methods, systems, and apparatuses for semiconductor devices are provided herein. A semiconductor device includes an array of conductive pads for signals. One or more non-linear compliant springs may be present to route signals from the conductive pads to interconnect pads formed on the semiconductor device to attach bump interconnects. Each non-linear compliant spring may include one or more routing segments. The semiconductor device may be mounted to a circuit board by the bump interconnects. When the semiconductor device operates, heat may be generated by the semiconductor device, causing thermal expansion by the semiconductor device and the circuit board. The semiconductor device and circuit board may expand by different amounts due to differences in their thermal coefficients of expansion. The non-linear compliant springs provide for compliance between the conductive pads and bump interconnects to allow for the different rates of expansion.

Abstract translation: 本文提供了用于半导体器件的方法，系统和装置。 半导体器件包括用于信号的导电焊盘阵列。 可以存在一个或多个非线性柔性弹簧以将信号从导电焊盘传送到在半导体器件上形成的互连焊盘以附接凸起互连。 每个非线性顺应弹簧可以包括一个或多个路线段。 半导体器件可以通过凸块互连件安装到电路板。 当半导体器件工作时，可能由半导体器件产生热量，引起半导体器件和电路板的热膨胀。 由于其热膨胀系数的差异，半导体器件和电路板可以扩展不同的量。 非线性柔性弹簧提供导电焊盘和凸块互连之间的顺应性，以允许不同的膨胀率。