Light-Emitting Device, Light-Emitting Substrate and Light-Emitting Apparatus

    公开(公告)号:US20250011646A1

    公开(公告)日:2025-01-09

    申请号:US18580198

    申请日:2023-01-28

    Abstract: A light-emitting device includes at least two capping layers which include a first capping layer closest to a second electrode. A refractive index of a capping layer closer to the second electrode is greater than that of a capping layer farther away from the second electrode. A first capping layer material satisfies at least one of: the intermolecular minimum center-of-mass distance of the first capping layer material is in a range of 2 Å to 6 Å, and the dimension of the molecular structure of the first capping layer material in the third direction is in a range of 3 Å to 15 Å; and further satisfies at least one of: the molecular volume of the first capping layer material is in a range of 4000 Bohr3 to 8000 Bohr3, and the molecular density of the first capping layer material is in a range of 1.2 g/cm3 to 2.6 g/cm3.

    Display substrate, adjustment method thereof, and display apparatus

    公开(公告)号:US11276739B2

    公开(公告)日:2022-03-15

    申请号:US16765232

    申请日:2019-11-26

    Abstract: A display substrate is provided. The display substrate includes a substrate (1), a first transistor (2) and a second transistor (3) on the substrate (1), directions of intrinsic threshold voltage shifts of the first transistor (2) and the second transistor (3) being opposite; and a shift adjustment structure (4) on the substrate (1). The shift adjustment structure (4) may be configured to input adjustment signals to the first transistor (2) and the second transistor (3) respectively to make threshold voltages of the first transistor (2) and the second transistor (3) shift in directions opposite to the directions of their intrinsic threshold voltage shifts respectively.

    Object stage and hot pressing apparatus

    公开(公告)号:US10286595B2

    公开(公告)日:2019-05-14

    申请号:US15320027

    申请日:2015-01-13

    Inventor: Lei Chen

    Abstract: An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21); the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.

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