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    METHOD OF VERIFYING PROCESS DATA OF DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL AND ELECTRONIC DEVICE
    2.
    发明申请
    METHOD OF VERIFYING PROCESS DATA OF DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20250086368A1

    公开(公告)日：2025-03-13

    申请号：US18552435

    申请日：2022-08-31

    Applicant: BEIJING ZHONGXIANGYING TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Nan Liu ,  Xuemei Lin ,  Jianmin Wu ,  Hong Wang

    IPC: G06F30/367

    Abstract: Provided are a method of verifying process data of a display panel, a device, a storage medium, and a product, which relates to a field of process verification technology. The method of verifying the process data of the display panel includes: generating, based on design data of a process of the display panel, simulation process data for performing the process; performing, by using a process model, a simulation of performing the process based on the simulation process data; and verifying, by using a measurement model, whether the simulation process data is applicable to actual production based on the simulation. The process model is constructed based on actual process data generated in an actual manufacturing process of the display panel, and the measurement model is constructed based on actual process data and actual measurement data which are generated in the actual manufacturing process of the display panel.

    Data processing method, device and system, and electronic device
    3.
    发明授权
    Data processing method, device and system, and electronic device 有权

    公开(公告)号：US12055914B2

    公开(公告)日：2024-08-06

    申请号：US17781127

    申请日：2020-10-30

    Applicant: Beijing Zhongxiangying Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yu Wang ,  Haijin Wang ,  Jianmin Wu ,  Hong Wang

    IPC: G05B19/406

    CPC classification number: G05B19/406 ,  G05B2219/32204

    Abstract: A data processing method includes: obtaining a defect type of a sample set in response to a first input of a user on a first interface, the sample set including samples, each sample having a first parameter used to represent a defect degree of the sample with regard to the defect type and a second parameter used to represent device informations of sample production devices through which the sample passes; calculating yield purity indexes of sample production devices on the samples based on first parameters and second parameters of the samples, so as to obtain influencing parameters of the sample production devices, an influencing parameter of each sample production device being used to represent an influence degree to which the sample production device affects an occurrence of the defect type on the samples; and displaying the influencing parameters of the sample production devices on a second interface.

    INTELLIGENT MANAGEMENT SYSTEM, INTELLIGENT MANAGEMENT METHOD, AND COMPUTER-PROGRAM PRODUCT
    8.
    发明申请
    INTELLIGENT MANAGEMENT SYSTEM, INTELLIGENT MANAGEMENT METHOD, AND COMPUTER-PROGRAM PRODUCT 有权

    公开(公告)号：US20220318697A1

    公开(公告)日：2022-10-06

    申请号：US17311348

    申请日：2020-09-03

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Nan Liu ,  Chuan Wang ,  Xuemei Lin ,  Jianmin Wu ,  Hong Wang

    IPC: G06Q10/06 ,  G06Q10/08 ,  G06Q30/02

    Abstract: An intelligent management system is provided. The intelligent management system includes an intelligent supply chain manager configured to generate supply chain limitations based on a supply chain knowledge graph comprising information of at least one of demand planning and forecasting, inventory planning, sales planning and forecasting, or budget planning; generate industry chain contingencies based on an industry chain event knowledge graph comprising information of at least one of event urgency level, event importance level, and event impact spread level; generate constraints on supply chain based on supply chain limitations and industry chain contingencies; and generate a proposal and provide the proposal to business systems for supply chain planning based on the constraints on supply chain, the proposal comprising proposal for at least one of demand re-planning and re-forecasting, inventory re-planning, sales re-planning and re-forecasting, or budget re-planning.

    Methods and devices for processing and retrieving defect information of product
    9.
    发明授权
    Methods and devices for processing and retrieving defect information of product 有权

    公开(公告)号：US12092587B2

    公开(公告)日：2024-09-17

    申请号：US17765595

    申请日：2021-04-30

    Applicant: Beijing Zhongxiangying Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Haijin Wang ,  Chuan Wang ,  Tian Lan ,  Jianmin Wu ,  Yu Feng ,  Hong Wang ,  Yu Wang ,  Fan Zhang ,  Jiawei Ren ,  Jing Xue ,  Jianfeng Zeng

    IPC: G01N21/95

    CPC classification number: G01N21/95 ,  G01N2021/9511

    Abstract: The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer. According to this, for the defect information on the current film layer, only the defect information caused by factors of the current film layer may be retained, and the defect information caused by the historical film layers will not be retained, and thus, on the one hand, the stored data volume may be reduced, and on the other hand, the complexity of subsequent analysis of defect information may be simplified.

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