-
公开(公告)号：US09666609B2
公开(公告)日：2017-05-30
申请号：US14469554
申请日：2014-08-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Yujun Zhang , Zengsheng He , Lei Chen
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/1259
Abstract: This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.
-
2.发明申请公开(公告)号：US20150348994A1
公开(公告)日：2015-12-03
申请号：US14469554
申请日：2014-08-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Yujun Zhang , Zengsheng He , Lei Chen
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/1259
Abstract: This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.
Abstract translation: 本公开涉及阵列基板布线及其制造和修理方法。 阵列基板布线包括形成在基板上用于传输电信号的第一布线; 形成在所述第一布线上的绝缘层; 形成在绝缘层上的与第一布线相对的第二布线，第二布线处于挂起状态，不发送电信号。 通过这样的双层布线结构，使用上层中的第二布线来阻止在绝缘层中产生的孔，使得外部水分不能经由绝缘层中的孔到达第一布线，从而保护第一 用于从腐蚀和划痕传输电信号的接线。
-
3.发明授权公开(公告)号：US10730275B2
公开(公告)日：2020-08-04
申请号：US15796704
申请日：2017-10-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zengsheng He , Changhai Feng , Zhaohui Li
Abstract: A membrane material lamination device and a membrane material laminating method using the same are provided. The membrane material lamination device includes: two support structures, each support structure includes a support surface, the two support structures is capable of being in either a first state where the support surfaces are located in an identical plane or a second state where the support surfaces are located in different planes; a pressure application mechanism configured to be located at a first position when the two support structures are in the first state to support the membrane material through the support surfaces of the two support structures, and moved to a second position when the two support structures are in the second state to support the membrane material through the pressure application mechanism and a first support structure; a first driving mechanism; and a second driving mechanism.
-
Patent Agency Ranking
4.发明申请ORGANIC LIGHT-EMITTING DIODE DEVICE, METHOD FOR PACKAGING THE SAME AND DISPLAY DEVICE 审中-公开有机发光二极管装置，其包装方法及其显示装置公开(公告)号：US20140167012A1
公开(公告)日：2014-06-19
申请号：US14105833
申请日：2013-12-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhongyuan Sun , Zengsheng He
CPC classification number: H01L51/5259 , H01L51/5246
Abstract: The present invention provided an OLED device, a method for packaging the same, and a display device. With the solution of the present invention, it is not necessary to dispose a recess in the package substrate and the cost of production and thickness of the package substrate are decreased. The OLED device comprises a package substrate and an array substrate a surface of which is formed thereon with an OLED structure. Edges of the array substrate and the package substrate are bonded by a frame sealant, and the OLED structure is positioned between the array substrate and the package substrate. The OLED device further comprises a moisture barrier layer on a surface of the OLED structure for block moisture and oxygen and a desiccant layer positioned between the moisture layer and the package substrate, the desiccant layer including desiccant particles for absorbing moisture and oxygen within the OLED device.
Abstract translation: 本发明提供一种OLED器件，其封装方法和显示器件。 利用本发明的解决方案，不需要在封装基板中设置凹部，并且降低了封装基板的制造成本和厚度。 OLED器件包括封装衬底和阵列衬底，其表面上形成有OLED结构。 阵列基板和封装基板的边缘通过框架密封剂结合，并且OLED结构位于阵列基板和封装基板之间。 OLED器件还包括在OLED结构的表面上用于阻挡水分和氧气的湿气阻隔层和位于湿气层和封装衬底之间的干燥剂层，干燥剂层包括用于吸收OLED器件内的水分和氧气的干燥剂颗粒 。
-
公开(公告)号：US10439162B2
公开(公告)日：2019-10-08
申请号：US15533443
申请日：2016-11-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yanan Niu , Hongwei Tian , Lei Chen , Zengsheng He
IPC: G09G3/3225 , H01L51/52 , H01L27/32
Abstract: The present application discloses a display panel having a display unit and an encapsulating structure for encapsulating the display unit. The encapsulating structure includes a growth layer on the display unit; and a graphene layer on a side of the growth layer distal to the display unit.
-
6.发明申请公开(公告)号：US20180281375A1
公开(公告)日：2018-10-04
申请号：US15796704
申请日：2017-10-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zengsheng He , Changhai Feng , Zhaohui Li
Abstract: A membrane material lamination device and a membrane material laminating method using the same are provided. The membrane material lamination device includes: two support structures, each support structure includes a support surface, the two support structures is capable of being in either a first state where the support surfaces are located in an identical plane or a second state where the support surfaces are located in different planes; a pressure application mechanism configured to be located at a first position when the two support structures are in the first state to support the membrane material through the support surfaces of the two support structures, and moved to a second position when the two support structures are in the second state to support the membrane material through the pressure application mechanism and a first support structure; a first driving mechanism; and a second driving mechanism.
-
公开(公告)号：US20180198086A1
公开(公告)日：2018-07-12
申请号：US15533443
申请日：2016-11-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yanan Niu , Hongwei Tian , Lei Chen , Zengsheng He
IPC: H01L51/52 , H01L27/32 , G09G3/3225
CPC classification number: H01L51/5237 , G09G3/3225 , G09G2310/0264 , H01L27/3244 , H01L51/5253
Abstract: The present application discloses a display panel having a display unit and an encapsulating structure for encapsulating the display unit. The encapsulating structure includes a growth layer on the display unit; and a graphene layer on a side of the growth layer distal to the display unit.
-
公开(公告)号：US09842735B2
公开(公告)日：2017-12-12
申请号：US14908678
申请日：2015-07-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yanan Niu , Chao Liu , Zengsheng He , Lei Chen , Yujun Zhang
IPC: H01L21/00 , H01L21/84 , H01L21/02 , H01L29/78 , H01L29/786 , H01L21/308 , H01L27/12 , H01L29/66
CPC classification number: H01L21/02675 , H01L21/02057 , H01L21/02532 , H01L21/02592 , H01L21/02686 , H01L21/3085 , H01L21/3086 , H01L27/1222 , H01L27/1274 , H01L27/1285 , H01L27/1288 , H01L27/1296 , H01L29/66757 , H01L29/786 , H01L29/78675
Abstract: A method of manufacturing a low temperature polycrystalline silicon thin film and a thin film transistor, a thin film transistor, a display panel and a display device are provided. The method includes: forming an amorphous silicon thin film (01) on a substrate (1); forming a pattern of a silicon oxide thin film (02) covering the amorphous silicon thin film (01), a thickness of the silicon oxide thin film (02) located at a preset region being larger than that of the silicon oxide thin film (02) located at other regions; and irradiating the silicon oxide thin film (02) by using excimer laser to allow the amorphous silicon thin film (01) forming an initial polycrystalline silicon thin film (04), the initial polycrystalline silicon thin film (04) located at the preset region being a target low temperature polycrystalline silicon thin film (05). The polycrystalline silicon thin film has more uniform crystal size.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.015 seconds)
