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公开(公告)号：US12191430B2
公开(公告)日：2025-01-07
申请号：US18043203
申请日：2022-03-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shipei Li , Wusheng Li , Ying Zhao , Huili Wu , Sheng Xu , Wei He , Renquan Gu , Wenqing Xue , Jianjun Zhao , Qi Yao
IPC: H01L33/58 , G02F1/1335 , G02F1/13357 , H01L25/075 , H01L33/62
Abstract: A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.
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公开(公告)号：US20220123178A1
公开(公告)日：2022-04-21
申请号：US17308285
申请日：2021-05-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Shipei Li , Ying Zhao , Wei He , Zhiwei Liang
Abstract: A light emitting base plate and a fabricating method thereof, and a displaying device. In the present disclosure, a light shielding layer is provided on a substrate, a driving functional layer is provided on the light shielding layer, and a light-emitting-device layer and a light absorbing layer are provided on the driving functional layer; the light-emitting-device layer includes a plurality of light emitting devices, and the light absorbing layer includes light absorbing structures each of which surrounds sides of one of the light emitting devices; and the light absorbing structures are configured for blocking light rays exiting from the sides of the light emitting devices.
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Patent Agency Ranking
公开(公告)号：US20200091246A1
公开(公告)日：2020-03-19
申请号：US16574055
申请日：2019-09-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shipei Li , Wusheng Li , Qi Yao , Dongsheng Li , Fang He , Huili Wu , Renquan Gu , Sheng Xu , Wei He , Dongsheng Yin , Ying Zhao
Abstract: A photosensitive sensor and a method of manufacturing the photosensitive sensor are disclosed. The photosensitive sensor includes a thin film transistor and a photosensitive element on a substrate, wherein the photosensitive element includes a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode. The second electrode is connected to a drain electrode of the thin film transistor. An orthographic projection of an active layer of the thin film transistor on the substrate is within an orthographic projection of the second electrode on the substrate. The second electrode includes at least two stacked conductive layers, at least one of the at least two stacked conductive layers being a light shielding metal layer.
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公开(公告)号：US11711948B2
公开(公告)日：2023-07-25
申请号：US17319409
申请日：2021-05-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shipei Li , Sheng Xu , Wei He , Ying Zhao , Huili Wu , Fang He , Renquan Gu , Lizhen Zhang , Yi Zhou , Wusheng Li , Qi Yao , Yang Yue
IPC: H01L27/32 , H10K59/123 , H10K59/122 , H10K59/124 , H10K71/00 , H10K59/12
CPC classification number: H10K59/123 , H10K59/122 , H10K59/124 , H10K71/00 , H10K59/1201
Abstract: The present disclosure relates to the field of display technology, and proposes a display panel, a preparation method thereof, and a display apparatus. The display panel includes an array substrate, a planarization layer group, and a plurality of sub-pixels. The array substrate includes a switch array formed by a plurality of switch units. The planarization layer group is provided on the array substrate, and nano-scale grooves are provided on the planarization layer group. The sub-pixels are provided on a side of the planarization layer group away from the array substrate. The sub-pixel includes a plurality of first electrodes, wherein the first electrode is connected to the switch unit of the array substrate, a nano-scale second gap is provided between two adjacent first electrodes, and an orthographic projection of the second gap on the array substrate is located within an orthographic projection of the groove on the array substrate.
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公开(公告)号：US11605239B2
公开(公告)日：2023-03-14
申请号：US17041516
申请日：2020-04-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shipei Li , Ying Zhao , Renquan Gu , Wei He , Huili Wu , Dongsheng Yin , Sheng Xu , Lizhen Zhang , Xuefei Zhao , Fang He , Yupeng Gao
IPC: G06V40/13 , H01L27/146
Abstract: Disclosed are a fingerprint recognition sensor, a manufacturing method, and a display device. The fingerprint recognition sensor includes a base substrate, a thin film transistor, on a side of the base substrate; and a photosensitive element, on a side of the base substrate away from the thin film transistor, the thin film transistor, the base substrate, and the photosensitive element are sequentially stacked in a thickness direction perpendicular to the base substrate, the base substrate includes a conductive structure penetrating through the base substrate in the thickness direction perpendicular to the base substrate, and the photosensitive element is connected with the thin film transistor through the conductive structure.
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公开(公告)号：US10956700B2
公开(公告)日：2021-03-23
申请号：US16519045
申请日：2019-07-23
Inventor： Ying Zhao , Shipei Li , Qingping Yin , Tao Li , Huili Wu , Chunming Cui , Zihao Zhao , Jie Jin , Weimeng Zhang
Abstract: The disclosure relates to a display device including: an organic light-emitting diode display panel, a fingerprint recognition layer located below the organic light-emitting diode display panel, and a light filtering layer located between the organic light-emitting diode display panel and the fingerprint recognition layer, where the light filtering layer is configured to filter out light rays with an incidence angle greater than a filter angle among light rays carrying fingerprint line information, and to transmit light rays with an incidence angle smaller than or equal to the filter angle, where the incidence angle is the angle between the light rays carrying fingerprint line information, and the direction perpendicular to the fingerprint recognition layer.
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公开(公告)号：US10818732B2
公开(公告)日：2020-10-27
申请号：US16574055
申请日：2019-09-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shipei Li , Wusheng Li , Qi Yao , Dongsheng Li , Fang He , Huili Wu , Renquan Gu , Sheng Xu , Wei He , Dongsheng Yin , Ying Zhao
IPC: H01L27/30 , H01L51/00 , H01L51/44 , H01L29/786
Abstract: A photosensitive sensor and a method of manufacturing the photosensitive sensor are disclosed. The photosensitive sensor includes a thin film transistor and a photosensitive element on a substrate, wherein the photosensitive element includes a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode. The second electrode is connected to a drain electrode of the thin film transistor. An orthographic projection of an active layer of the thin film transistor on the substrate is within an orthographic projection of the second electrode on the substrate. The second electrode includes at least two stacked conductive layers, at least one of the at least two stacked conductive layers being a light shielding metal layer.
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