公开(公告)号：US12191430B2

公开(公告)日：2025-01-07

申请号：US18043203

申请日：2022-03-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Wusheng Li ,  Ying Zhao ,  Huili Wu ,  Sheng Xu ,  Wei He ,  Renquan Gu ,  Wenqing Xue ,  Jianjun Zhao ,  Qi Yao

IPC: H01L33/58 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.