公开(公告)号：US11468819B2

公开(公告)日：2022-10-11

申请号：US16614365

申请日：2019-04-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dongni Liu ,  Minghua Xuan ,  Lei Wang ,  Xiaochuan Chen ,  Liang Chen ,  Li Xiao ,  Detao Zhao ,  Shengji Yang ,  Pengcheng Lu ,  Zheng Fang

IPC: G09G3/3266 ,  G09G3/20

Abstract: The present disclosure relates to the field of display technologies, and in particular, to a shift register circuit and a display device. The shift register circuit may include a plurality of GOAs for outputting scan signals to a plurality of pixel driving circuits and a plurality of EOAs for outputting control signals to the plurality of pixel driving circuits, where the GOAs and the EOAs are alternately arranged in a straight line.

公开(公告)号：US11355061B2

公开(公告)日：2022-06-07

申请号：US16757526

申请日：2019-08-07

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liang Chen ,  Lei Wang ,  Li Xiao ,  Dongni Liu ,  Detao Zhao ,  Ning Cong ,  Minghua Xuan ,  Shengji Yang ,  Xiaochuan Chen

IPC: G09G3/3233 ,  G09G3/3258 ,  H01L27/32

Abstract: The present disclosure relates to a pixel circuit, a driving method therefor, and a display apparatus. The pixel circuit includes an input sub-circuit, a light emission control sub-circuit and an organic light-emitting transistor. The input sub-circuit is coupled to a gate line, a data line and the light emission control sub-circuit and writes a data signal supplied via the data line into the light emission control sub-circuit under control of a gate scan signal supplied via the gate line. The light emission control sub-circuit is coupled to a control electrode of the organic light-emitting transistor and controls a control electrode voltage of the organic light-emitting transistor according to a written data signal to drive the organic light-emitting transistor to emit light. With the pixel circuit according to embodiments of the present disclosure, active driving of an organic light-emitting transistor is achieved when it is applied in a display apparatus.

公开(公告)号：US11335242B2

公开(公告)日：2022-05-17

申请号：US16652535

申请日：2019-10-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dongni Liu ,  Minghua Xuan ,  Liang Chen ,  Detao Zhao ,  Li Xiao ,  Zheng Fang

IPC: G09G3/32 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: The present disclosure provides a display substrate, including: a substrate; a plurality of pixel units on the substrate, each of the pixel units having a light-emitting device therein; a power supply electrode configured to supply a power supply voltage to the light-emitting device, wherein the power supply electrode includes a first electrode layer and a second electrode layer, the second electrode layer has a mesh-shaped structure and is coupled to the first electrode layer through a via hole, and the first electrode layer includes a plurality of first electrode parts spaced apart from each other and each having a block shape, each of the first electrode parts being electrically coupled to a plurality of light-emitting devices for supplying the power supply voltage to the plurality of light-emitting devices.

公开(公告)号：US11320932B2

公开(公告)日：2022-05-03

申请号：US16496236

申请日：2019-04-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Detao Zhao ,  Pengcheng Lu ,  Liang Chen ,  Ning Cong ,  Ming Yang ,  Dongni Liu ,  Li Xiao ,  Shengji Yang ,  Lei Wang ,  Minghua Xuan ,  Xiaochuan Chen

IPC: G06F3/041 ,  H01L27/32

Abstract: A touch display panel and a method for manufacturing the same are provided. The method includes: forming touch lines, an insulating layer and first electrodes above a substrate, the insulating layer covers the touch lines and is provided with at least one through-hole, the first electrodes are at a side of the insulating layer distal from the touch lines; forming barrier walls in each through-hole, and at a predetermined position in an interval between the first electrodes; forming a light emitting layer and a second electrode layer at a side of the light emitting layer distal from the substrate; removing the barrier walls, portions of the light emitting layer and the second electrode layer above the barrier walls, remaining portions of the second electrode layer form touch electrodes; forming an electrical conductive structure in each through-hole for coupling one touch line to one touch electrode.

公开(公告)号：US11315479B2

公开(公告)日：2022-04-26

申请号：US16610007

申请日：2019-02-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ning Cong ,  Minghua Xuan ,  Han Yue ,  Ming Yang ,  Xiaochuan Chen ,  Can Zhang ,  Can Wang ,  Liang Chen ,  Detao Zhao

IPC: G09G3/32

Abstract: An array substrate including a plurality of pixel units arranged in a matrix is provided. Each pixel unit at least includes a first sub-pixel, a second sub-pixel and a third sub-pixel that emit light of different colors, the first sub-pixel has a lower luminous efficiency than the second and third sub-pixels. The array substrate further comprises a plurality of first gate lines and a plurality of second gate lines that correspond to respective rows of pixel units of the plurality of pixel units. The first sub-pixel in each row of pixel units of the plurality of pixel units is coupled to a first gate line of the plurality of first gate lines, and the second sub-pixel and the third sub-pixel in the row of pixel units of the plurality of pixel units are both coupled to a second gate line of the plurality of second gate lines.

公开(公告)号：US20210273133A1

公开(公告)日：2021-09-02

申请号：US17256185

申请日：2020-04-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liang Chen ,  Lei Wang ,  Minghua Xuan ,  Dongni Liu ,  Li Xiao ,  Detao Zhao ,  Hao Chen

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/00

Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

公开(公告)号：US11901486B2

公开(公告)日：2024-02-13

申请号：US17256185

申请日：2020-04-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liang Chen ,  Lei Wang ,  Minghua Xuan ,  Dongni Liu ,  Li Xiao ,  Detao Zhao ,  Hao Chen

IPC: H01L33/00 ,  H01L23/00 ,  H01L33/20

CPC classification number: H01L33/20 ,  H01L24/81 ,  H01L33/005 ,  H01L24/14 ,  H01L2933/0066

Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

公开(公告)号：US11450270B2

公开(公告)日：2022-09-20

申请号：US16484621

申请日：2019-01-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liang Chen ,  Lei Wang ,  Dongni Liu ,  Li Xiao ,  Minghua Xuan ,  Xiaochuan Chen ,  Shengji Yang ,  Pengcheng Lu ,  Detao Zhao ,  Ning Cong

IPC: G09G3/3233 ,  G09G3/3275

Abstract: A pixel circuit and a method of driving the same, and a display device. The pixel circuit includes a plurality of pixel compensation circuits, and each pixel compensation circuit can be connected to M light-emitting units located in the same column. Each light-emitting control signal terminal of the M light-emitting control signal terminals included in each light-emitting control signal terminal group may be connected to a pixel compensation circuit group (i.e., K rows of pixels compensation circuits).

公开(公告)号：US11217182B2

公开(公告)日：2022-01-04

申请号：US16338813

申请日：2018-10-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Minghua Xuan ,  Lei Wang ,  Xiaochuan Chen ,  Dongni Liu ,  Detao Zhao

IPC: G09G3/3291

Abstract: The present disclosure provides a power source voltage application circuit, including a power source voltage output end, an energy storage sub-circuitry, a resetting sub-circuitry and an output control sub-circuitry. A first end of the energy storage sub-circuitry is connected to a first node, and a second end of the energy storage sub-circuitry is connected to a second node. The resetting sub-circuitry is connected to a resetting control end, a reference voltage input tend, the first node, the second node and an initial voltage input end respectively. The output control sub-circuitry is connected to an output control end, a first voltage input end, the first node, the second node and the power source voltage output end respectively.

公开(公告)号：US11177294B2

公开(公告)日：2021-11-16

申请号：US16701706

申请日：2019-12-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Dongni Liu ,  Minghua Xuan ,  Li Xiao ,  Detao Zhao ,  Liang Chen ,  Hao Chen

IPC: H01L23/48 ,  H01L27/12 ,  H01L21/288 ,  H01L21/768 ,  H01L23/522

Abstract: An array substrate, a manufacturing method thereof and a display device are provided. A display unit is disposed on a first surface of a base substrate, and a driving circuit is disposed on a second surface of the base substrate opposite to the first surface, the driving circuit is electrically connected with the display unit through a signal connection structure in at least one via structure, a longitudinal section of the at least one via hole is a trapezoid, and a length of a bottom edge of the trapezoid at one side of the trapezoid close to the display unit is larger than a length of a bottom edge of the trapezoid at one side of the trapezoid away from the display unit.