Light-emitting substrate, method for forming the light-emitting substrate and display device

    公开(公告)号:US12266747B2

    公开(公告)日:2025-04-01

    申请号:US17522282

    申请日:2021-11-09

    Abstract: The present disclosure discloses a light-emitting substrate, a method for forming the light-emitting substrate and a display device. The light-emitting substrate includes: a base substrate; a first signal line located at one side of the base substrate; an insulation layer located at one side of the first signal line away from the base substrate; an electrode layer located at one side of the insulation layer away from the base substrate and including a first electrode terminal, a second electrode terminal and a second signal line, where the first electrode terminal is electrically connected to the first signal line via a first through hole penetrating the insulation layer; and at least one light-emitting element bound and connected to the first electrode terminal and the second electrode terminal.

    Pixel circuit and driving method therefor, display substrate, and display apparatus

    公开(公告)号:US12266301B2

    公开(公告)日:2025-04-01

    申请号:US17772029

    申请日:2021-06-30

    Abstract: A pixel circuit includes a first driving circuit, a first control circuit, a second driving circuit and a second control circuit. The first driving circuit is configured to write a first data signal into a first node in response to a scanning signal. The first control circuit is configured to transmit a first voltage signal to the first driving circuit, and transmit a first driving signal generated by the first driving circuit according to a voltage of the first node and the first voltage signal in response to an enable signal. The second driving circuit is configured to write a second data signal into a second node in response to the scanning signal. The second control circuit is configured to transmit a second driving signal generated by the second driving circuit according to a voltage of the second node and the first voltage signal in response to a control signal.

    Method for detecting resistance of side trace of display substrate and display substrate

    公开(公告)号:US12198989B2

    公开(公告)日:2025-01-14

    申请号:US17255079

    申请日:2019-11-29

    Abstract: The present disclosure provides a method for detecting resistance of a side trace of a display substrate and the display substrate, and belongs to the field of display technology. In the method for detecting resistance of a side trace of a display substrate, the display substrate includes: a base substrate including a first surface and a second surface opposite to each other; a plurality of first pads at intervals on the first surface; and a plurality of second pads at intervals on the second surface; the first pad is electrically connected to a corresponding second pad through a side trace; the method includes forming at least one detection unit; wherein forming the detection unit includes: connecting two first pads through a connection part; and detecting two second pads in the detection unit, and obtaining resistance of the detection unit to obtain the resistance of the side trace.

    Pixel circuit and method for driving same, display panel, and display device

    公开(公告)号:US11996035B2

    公开(公告)日:2024-05-28

    申请号:US17639790

    申请日:2021-03-11

    CPC classification number: G09G3/32 G09G2300/0842 G09G2310/061

    Abstract: Provided is a pixel circuit. The pixel circuit includes a reset circuit, a data write circuit, a light-emission control circuit, and a drive circuit; wherein the reset circuit is configured to transmit a reset power signal supplied by the reset power terminal to the first node in response to a reset control signal; the data write circuit is configured to transmit a data signal supplied by the data signal terminal to the first node in response to a gate drive signal; the light-emission control circuit is configured to control conduction/non-conduction between the cathode of the light-emitting element and the second node, and control conduction/non-conduction between the third node and the pull-down power terminal, in response to a light-emission control signal; and the drive circuit is configured to control conduction/non-conduction between the second node and the third node in response to a potential of the first node.

    Light-emitting driving circuit and driving method thereof, and light-emitting apparatus

    公开(公告)号:US11568797B2

    公开(公告)日:2023-01-31

    申请号:US17408967

    申请日:2021-08-23

    Abstract: A light-emitting driving circuit includes a driving sub-circuit, a control sub-circuit, a data writing sub-circuit and a compensation sub-circuit. The control sub-circuit is configured to initialize voltages of a first node and a control terminal of the driving sub-circuit in response to a second scan signal. The data writing sub-circuit is configured to write a data signal into a first terminal of the driving sub-circuit in response to a first scan signal. The driving sub-circuit is configured to output, from a second terminal of the driving sub-circuit, the data signal and a compensation signal. The compensation sub-circuit is configured to transmit the data signal and the compensation signal to the first node in response to the first scan signal, and adjust the voltage of the control terminal according to the data signal, the compensation signal, the initialized voltages of the first node and the control terminal.

    METHOD FOR TRANSFERING CHIP, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE

    公开(公告)号:US20210273133A1

    公开(公告)日:2021-09-02

    申请号:US17256185

    申请日:2020-04-03

    Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

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