PROCESS CHAMBER AND SEMICONDUCTOR PROCESSING APPARATUS
    1.
    发明申请
    PROCESS CHAMBER AND SEMICONDUCTOR PROCESSING APPARATUS 审中-公开
    工艺台和半导体加工设备

    公开(公告)号:US20160322206A1

    公开(公告)日:2016-11-03

    申请号:US15109050

    申请日:2014-12-29

    摘要: Embodiments of the invention provide a process chamber and a semiconductor processing apparatus. According to at least one embodiment, the process chamber includes a reaction compartment, a gas introducing system and a wafer transfer device. The reaction compartment is provided in the process chamber and used for performing a process on a wafer, the gas introducing system is used for providing processing gas to the reaction compartment, and the wafer transfer device is used for transferring the wafer into the reaction compartment. A lining ring assembly is provided in the reaction compartment, and is configured such that a flow uniformizing cavity is formed between the lining ring assembly itself and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas, from the gas introducing system, into the reaction compartment through the flow uniformizing cavity.

    摘要翻译: 本发明的实施例提供一种处理室和半导体处理装置。 根据至少一个实施例,处理室包括反应室,气体引入系统和晶片转移装置。 反应室设置在处理室中,用于在晶片上进行处理,气体导入系统用于向反应室提供处理气体,并且晶片转移装置用于将晶片转移到反应室中。 衬套环组件设置在反应室中,并且构造成使得在衬套环组件本身和反应室的内侧壁之间形成流动均匀化空腔,从而均匀地输送来自气体的处理气体 引入系统,通过流动均匀化腔进入反应室。

    MAGNETRON AND MAGNETRON SPUTTERING DEVICE
    2.
    发明申请
    MAGNETRON AND MAGNETRON SPUTTERING DEVICE 审中-公开
    MAGNETRON和MAGNETRON SPUTTERING设备

    公开(公告)号:US20170011894A1

    公开(公告)日:2017-01-12

    申请号:US15113760

    申请日:2014-12-31

    摘要: Embodiments of the invention provide a magnetron and a magnetron sputtering device, including an inner magnetic pole and an outer magnetic pole with opposite polarities. Both the inner magnetic pole and the outer magnetic pole comprise multiple spirals. The spirals of the outer magnetic pole surround the spirals of the inner magnetic pole, and a gap therebetween. In addition, the gap has different widths in different locations from a spiral center to an edge. Moreover, both the spirals of the outer magnetic pole and the spirals of the inner magnetic pole follow a polar equation: r=aθn+b(cos θ)m+c(tan θ)k+d, 0

    摘要翻译: 本发明的实施例提供一种磁控管和磁控溅射装置,其包括具有相反极性的内磁极和外磁极。 内磁极和外磁极都包括多个螺旋。 外磁极的螺旋包围着内磁极的螺旋线和它们之间的间隙。 另外,间隙在从螺旋中心到边缘的不同位置具有不同的宽度。 此外,外磁极的螺旋和内磁极的螺旋都遵循极性方程:r =aθn+ b(cosθ)m + c(tanθ)k + d,0 <= n <= 2 ,0 <= m <= 2,c = 0或k = 0。 由于内磁极和外磁极之间的间隙在螺旋离散方向上具有不同的宽度,所以可以改变不同位置的间隙的宽度尺寸以控制平面中的磁场强度分布,从而调节 膜厚度。