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公开(公告)号：US20230371315A1
公开(公告)日：2023-11-16
申请号：US18315362
申请日：2023-05-10
Applicant: Applied Materials, Inc.
Inventor： Jungmin LEE , Chung-chia CHEN , Ji Young CHOUNG , Yu-hsin LIN
IPC: H10K59/122 , H10K59/80 , H10K59/12
CPC classification number: H10K59/122 , H10K59/80521 , H10K59/1201
Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.
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公开(公告)号：US20230301139A1
公开(公告)日：2023-09-21
申请号：US18006237
申请日：2021-06-08
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Yu-hsin LIN
IPC: H10K59/122 , H10K59/173 , H10K59/80 , H10K59/12 , H10K71/60
CPC classification number: H10K59/122 , H10K59/173 , H10K59/80521 , H10K59/1201 , H10K71/60
Abstract: The present disclosure relates to overhang structures and methods of fabricating a sub-pixel circuit with the overhang structures that may be utilized in a display such as an organic light-emitting diode (OLED) display. The adjacent inorganic silicon-containing overhang structures defining each sub-pixel of the sub- pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the inorganic silicon-containing overhang structures to remain in place after the sub-pixel circuit is formed. A first configuration of the inorganic silicon-containing overhang structures includes a gradient concentration profile. A second configuration of the inorganic silicon-containing overhang structures includes an upper portion and a lower portion. The inorganic silicon-containing overhang structures define deposition angles for each of the OLED material and the cathode such the OLED material does not contact sidewalls of the inorganic silicon-containing overhang structures.
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公开(公告)号：US20230284484A1
公开(公告)日：2023-09-07
申请号：US18314915
申请日：2023-05-10
Applicant: Applied Materials, Inc.
Inventor： Ji-young CHOUNG , Dieter HAAS , Yu-hsin LIN , Jungmin LEE , Seong Ho YOO , Si Kyoung KIM
IPC: H10K59/122 , H10K50/84 , H10K50/844 , H10K71/00
CPC classification number: H10K59/122 , H10K50/84 , H10K50/844 , H10K71/00 , H10K59/1201
Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.
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公开(公告)号：US20240023379A1
公开(公告)日：2024-01-18
申请号：US18352802
申请日：2023-07-14
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Chung-chia CHEN , Yu-hsin LIN , Jungmin LEE , Dieter HAAS , Si Kyoung KIM
IPC: H10K59/122 , H10K50/84 , H10K71/16
CPC classification number: H10K59/122 , H10K50/84 , H10K71/16 , H10K2102/103
Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.
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公开(公告)号：US20230263014A1
公开(公告)日：2023-08-17
申请号：US18183822
申请日：2023-03-14
Applicant: Applied Materials, Inc.
Inventor： Yu-hsin LIN , Ji Young CHOUNG , Chung-chia CHEN , Jungmin LEE , Wen-Hao WU , Takashi ANJIKI , Takuji KATO , Dieter HAAS , Si Kyoung KIM , Stefan KELLER
IPC: H10K59/122 , H10K59/173
CPC classification number: H10K59/122 , H10K59/173 , H10K71/16
Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.
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Patent Agency Ranking
公开(公告)号：US20230076050A1
公开(公告)日：2023-03-09
申请号：US18049825
申请日：2022-10-26
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Dieter HAAS , Yu-hsin LIN , Jungmin LEE , Seong Ho YOO , Si Kyoung KIM
Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.
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公开(公告)号：US20250048845A1
公开(公告)日：2025-02-06
申请号：US18774523
申请日：2024-07-16
Applicant: Applied Materials, Inc.
Inventor： Jungmin LEE , Dieter HAAS , Yu-hsin LIN , Chung-chia CHEN , Ji Young CHOUNG
IPC: H10K59/122
Abstract: The present disclosure provides sub-pixels. The sub-pixels include a plurality of pixel structures separating a plurality of anodes. The plurality of pixel structures are disposed over a substrate. A plurality of overhang structures are disposed over the plurality of pixel structures. Each overhang structure of the plurality of overhang structures include an upper portion including amorphous silicon disposed over a lower portion including germanium. A bottom surface of the upper portion extends laterally past an upper surface of the lower portion. An organic light emitting diode (OLED) material is disposed over an upper surface of the plurality of anodes and an upper surface of the plurality of pixel structures. A cathode is disposed over the OLED material and the upper surface of the plurality of pixel structures.
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公开(公告)号：US20230061457A1
公开(公告)日：2023-03-02
申请号：US18049868
申请日：2022-10-26
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Dieter HAAS , Yu-hsin LIN , Jungmin LEE , Seong Ho YOO , Si Kyoung KIM
Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.
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公开(公告)号：US20230013772A1
公开(公告)日：2023-01-19
申请号：US17935770
申请日：2022-09-27
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Chung-chia CHEN , Yu-hsin LIN , Jungmin LEE , Dieter HAAS , Si Kyoung KIM
Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.
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公开(公告)号：US20240164149A1
公开(公告)日：2024-05-16
申请号：US18545676
申请日：2023-12-19
Applicant: Applied Materials, Inc.
Inventor： Ji Young CHOUNG , Dieter HAAS , Yu-hsin LIN , Jungmin LEE , Seong Ho YOO , Si Kyoung KIM
IPC: H10K59/122 , H10K50/84 , H10K50/844 , H10K71/00
CPC classification number: H10K59/122 , H10K50/84 , H10K50/844 , H10K71/00 , H10K59/1201
Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.
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