公开(公告)号：US20230284484A1

公开(公告)日：2023-09-07

申请号：US18314915

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230263012A1

公开(公告)日：2023-08-17

申请号：US18139243

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/873

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20240164149A1

公开(公告)日：2024-05-16

申请号：US18545676

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230269969A1

公开(公告)日：2023-08-24

申请号：US18040161

申请日：2021-07-27

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Seong Ho YOO ,  Dieter HAAS ,  Si Kyoung KIM ,  Yu-hsin LIN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

CPC classification number: H10K59/122 ,  H10K59/873 ,  H10K59/1201

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

公开(公告)号：US20220077251A1

公开(公告)日：2022-03-10

申请号：US17193321

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.

公开(公告)号：US20250107353A1

公开(公告)日：2025-03-27

申请号：US18977548

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20240040831A1

公开(公告)日：2024-02-01

申请号：US18363574

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/121 ,  H10K59/65 ,  H10K59/12

CPC classification number: H10K59/121 ,  H10K59/65 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.

公开(公告)号：US20230255064A1

公开(公告)日：2023-08-10

申请号：US18301805

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US20230041252A1

公开(公告)日：2023-02-09

申请号：US17881358

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US20240065043A1

公开(公告)日：2024-02-22

申请号：US18498140

申请日：2023-10-31

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Jungmin LEE ,  Chung-chia CHEN ,  Yusin LIN ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K59/173

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.