METHODS AND APPARATUS FOR ORGANIC LIGHT EMITTING DIODE DISPLAY STRUCTURES

    公开(公告)号:US20220376204A1

    公开(公告)日:2022-11-24

    申请号:US17754233

    申请日:2020-09-14

    Abstract: Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided. In one embodiment, a method for forming an organic light emitting diode (OLED) substrate is provided that includes forming a first conductive layer on a substrate in a first direction, forming a dielectric layer on a portion of the first conductive layer, wherein the dielectric layer includes a well having a portion of the first conductive layer exposed, depositing an organic material into the well and on the dielectric layer continuously in the second direction and between the two bus bars, and forming a second conductive layer on the organic material continuously in a second direction orthogonal to the first direction and between two bus bars, wherein the second conductive layer is in direct contact with the bus bars on opposing sides thereof; and depositing an encapsulating layer on the second conductive layer continuously in the second direction and fully cover the second conductive layer.

    OLED PANEL WITH INORGANIC PIXEL ENCAPSULATING BARRIER

    公开(公告)号:US20220077251A1

    公开(公告)日:2022-03-10

    申请号:US17193321

    申请日:2021-03-05

    Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.

    CONDUCTIVE OXIDE OVERHANG STRUCTURES FOR OLED DEVICES

    公开(公告)号:US20240341125A1

    公开(公告)日:2024-10-10

    申请号:US18744244

    申请日:2024-06-14

    CPC classification number: H10K59/122 H10K50/84 H10K71/16 H10K2102/103

    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

    CONDUCTIVE OXIDE OVERHANG STRUCTURES FOR OLED DEVICES

    公开(公告)号:US20220344417A1

    公开(公告)日:2022-10-27

    申请号:US17389934

    申请日:2021-07-30

    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

    METHODS OF FABRICATING OLED PANEL WITH INORGANIC PIXEL ENCAPSULATING BARRIER

    公开(公告)号:US20220077252A1

    公开(公告)日:2022-03-10

    申请号:US17193347

    申请日:2021-03-05

    Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

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