公开(公告)号：US20220363947A1

公开(公告)日：2022-11-17

申请号：US17741658

申请日：2022-05-11

Applicant: Applied Materials, Inc.

Inventor： Vibhas Singh ,  Wen-Hao Wu ,  Jrjyan Jerry Chen ,  Soo Young Choi

IPC: C09D183/08 ,  B65D25/34 ,  C23C14/00 ,  C23C14/54

Abstract: Packaging materials and methods of manufacture are disclosed. The packaging material comprises a substrate surface and film coating selected from the group consisting of an elastomer, a polymer, an inorganic material and combinations thereof. The film coating includes a first layer and a second layer, the first layer deposited on the second layer. The first layer has a formula of SiOxNyCz, where x is in a range from 1.9 to 2.15, y is in a range from 0.01 to 0.08, and z is in a range from 0.10 to 0.40.

公开(公告)号：US11038153B2

公开(公告)日：2021-06-15

申请号：US16248526

申请日：2019-01-15

Applicant: Applied Materials, Inc.

Inventor： Wen-Hao Wu ,  Jrjyan Jerry Chen

IPC: H01L51/56 ,  H01L51/00 ,  H01L51/52

Abstract: Embodiments of the present disclosure generally relate to methods for forming an organic light emitting diode (OLED) device. Forming the OLED device comprises depositing a first barrier layer on a substrate having an OLED structure disposed thereon. A first sublayer of a buffer layer is then deposited on the first barrier layer. The first sublayer of the buffer layer is cured with a mixed gas plasma. Curing the first sublayer comprises generating water from the mixed gas plasma in a process chamber in which the curing occurs. The deposition of the first sublayer and the curing of the first sublayer is repeated one or more times to form a completed buffer layer. A second barrier layer is then deposited on the completed buffer layer.

公开(公告)号：US11665931B2

公开(公告)日：2023-05-30

申请号：US17881358

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia Chen ,  Ji Young Choung ,  Dieter Haas ,  Yu-Hsin Lin ,  Jungmin Lee ,  Wen-Hao Wu ,  Si Kyoung Kim

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52 ,  H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K102/00

CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US12120925B2

公开(公告)日：2024-10-15

申请号：US18301805

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Chung-chia Chen ,  Ji Young Choung ,  Dieter Haas ,  Yu-hsin Lin ,  Jungmin Lee ,  Wen-Hao Wu ,  Si Kyoung Kim

IPC: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K102/00

CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US12127441B2

公开(公告)日：2024-10-22

申请号：US18183822

申请日：2023-03-14

Applicant: Applied Materials, Inc.

Inventor： Yu-hsin Lin ,  Ji Young Choung ,  Chung-chia Chen ,  Jungmin Lee ,  Wen-Hao Wu ,  Takashi Anjiki ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Stefan Keller

IPC: H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

公开(公告)号：US12041840B2

公开(公告)日：2024-07-16

申请号：US17313867

申请日：2021-05-06

Applicant: Applied Materials, Inc.

Inventor： Wen-Hao Wu ,  Jrjyan Jerry Chen

IPC: H10K71/00 ,  H10K50/844 ,  H10K85/40 ,  H10K102/00

CPC classification number: H10K71/00 ,  H10K50/8445 ,  H10K85/40 ,  H10K2102/351

Abstract: Embodiments of the present disclosure generally relate to methods for forming an organic light emitting diode (OLED) device. Forming the OLED device comprises depositing a first barrier layer on a substrate having an OLED structure disposed thereon. A first sublayer of a buffer layer is then deposited on the first barrier layer. The first sublayer of the buffer layer is cured with a mixed gas plasma. Curing the first sublayer comprises generating water from the mixed gas plasma in a process chamber in which the curing occurs. The deposition of the first sublayer and the curing of the first sublayer is repeated one or more times to form a completed buffer layer. A second barrier layer is then deposited on the completed buffer layer.

公开(公告)号：US11610954B1

公开(公告)日：2023-03-21

申请号：US17744364

申请日：2022-05-13

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin Lin ,  Ji-Young Choung ,  Chung-Chia Chen ,  Jungmin Lee ,  Wen-Hao Wu ,  Takashi Anjiki ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Stefan Keller

IPC: H01L27/32 ,  H01L51/52

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed over and extending laterally past a base structure disposed over the PDL structure. Each second overhang is defined by a top structure disposed over and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed over the HIL material and extends under the first overhang.