公开(公告)号：US11626569B1

公开(公告)日：2023-04-11

申请号：US17805257

申请日：2022-06-03

Applicant: Applied Materials, Inc.

Inventor： Jungmin Lee ,  Yu Hsin Lin ,  Chung-Chia Chen ,  Ji Young Choung ,  Dieter Haas ,  Si Kyoung Kim

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

公开(公告)号：US11527732B1

公开(公告)日：2022-12-13

申请号：US17828360

申请日：2022-05-31

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia Chen ,  Yu-Hsin Lin ,  Jungmin Lee ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Ji Young Choung

IPC: H01L29/08 ,  H01L51/44 ,  H01L51/52 ,  H01L51/00

Abstract: Exemplary methods of backplane processing are described. The methods may include forming a first metal oxide material on a substrate. The methods may include forming a metal layer over the first metal oxide material. The metal layer may be or include silver. The methods may include forming an amorphous protection material over the metal layer. The amorphous protection material may include a second metal oxide material. The methods may include forming a second metal oxide material over the amorphous protection material. The second metal oxide material may include a crystalline material having one or more grain boundaries. The grain boundaries may include one or more voids.

公开(公告)号：US11355724B2

公开(公告)日：2022-06-07

申请号：US16685944

申请日：2019-11-15

Applicant: Applied Materials, Inc

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L29/08 ,  H01L51/50 ,  H01L51/52 ,  H01L51/56 ,  H01L51/00 ,  H01L51/42

Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers; a light extraction layer (LEL) comprising a UV-cured ink; and a UV blocking layer between the LEL and the stack of OLED layers.

公开(公告)号：US20210159452A1

公开(公告)日：2021-05-27

申请号：US16696949

申请日：2019-11-26

Applicant: Applied Materials, Inc.

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: An organic light-emitting diode (OLED) structure including a substrate; a dielectric layer on the substrate having an array of well structures, wherein each well structure includes a recess with side walls and a floor, and the well structures are separated by plateaus; a stack of OLED layers covering at least the floor of the well; a light extraction layer (LEL) in the well over the stack of OLED layers; and a coating covering a portion of the stack of OLED layers such that a top surface of the plateaus is more hydrophobic than a surface in the well on which the light extraction layer is formed.

公开(公告)号：US11956994B2

公开(公告)日：2024-04-09

申请号：US17398442

申请日：2021-08-10

Applicant: Applied Materials, Inc.

Inventor： Chung-Chih Wu ,  Hoang Yan Lin ,  Guo-Dong Su ,  Zih-Rou Cyue ,  Li-Yu Yu ,  Wei-Kai Lee ,  Guan-Yu Chen ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Gang Yu ,  Byung-Sung Kwak ,  Robert Jan Visser ,  Chi-Jui Chang

IPC: H10K50/858 ,  G09F9/33 ,  H04N13/302

CPC classification number: H10K50/858 ,  G09F9/335 ,  H04N13/302

Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.

公开(公告)号：US11456345B1

公开(公告)日：2022-09-27

申请号：US17662960

申请日：2022-05-11

Applicant: Applied Materials, Inc.

Inventor： Ji-young Choung ,  Chung-Chia Chen ,  Yu Hsin Lin ,  Jungmin Lee ,  Dieter Haas ,  Si Kyoung Kim

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US11121345B2

公开(公告)日：2021-09-14

申请号：US16696971

申请日：2019-11-26

Applicant: Applied Materials, Inc.

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: An organic light-emitting diode (OLED) structure includes a substrate, a dielectric layer on the substrate having an array of well structures with each well structure including a recess with side walls and a floor and the recesses are separated by plateaus having rounded top surfaces, a stack of OLED layers covering at least the floor of the well, and a light extraction layer (LEL) in the well over the stack of OLED layers.

公开(公告)号：US20210135140A1

公开(公告)日：2021-05-06

申请号：US16685944

申请日：2019-11-15

Applicant: Applied Materials, Inc

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/50 ,  H01L51/56 ,  H01L51/52

Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers; a light extraction layer (LEL) comprising a UV-cured ink; and a UV blocking layer between the LEL and the stack of OLED layers.

公开(公告)号：US12101947B2

公开(公告)日：2024-09-24

申请号：US17985632

申请日：2022-11-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia Chen ,  Yu-Hsin Lin ,  Jungmin Lee ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Ji Young Choung

IPC: H01L29/08 ,  H10K30/82 ,  H10K50/81 ,  H10K71/20 ,  H10K102/00 ,  H10K102/10

CPC classification number: H10K30/82 ,  H10K50/81 ,  H10K71/231 ,  H10K2102/00 ,  H10K2102/102 ,  H10K2102/103

Abstract: Exemplary methods of OLED device processing are described. The methods may include forming an anode on a substrate. Forming the anode may include forming a first metal oxide material on the substrate, forming a metal layer over the first metal oxide material, forming a protective barrier over the metal layer, and forming a second metal oxide material over the amorphous protection material. The protective barrier may be an amorphous protection material overlying the metal layer.

公开(公告)号：US20230180506A1

公开(公告)日：2023-06-08

申请号：US17653329

申请日：2022-03-03

Applicant: Applied Materials, Inc

Inventor： Jungmin LEE ,  Yu Hsin Lin ,  Chung-Chia Chen ,  Ji-young Choung ,  Dieter Haas ,  Si Kyoung Kim

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

CPC classification number: H01L51/5225 ,  H01L27/3246 ,  H01L51/5253 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.