Graphite susceptor
    2.
    发明授权

    公开(公告)号:US11021794B2

    公开(公告)日:2021-06-01

    申请号:US16011383

    申请日:2018-06-18

    Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.

    Support cylinder for thermal processing chamber

    公开(公告)号:US09659809B2

    公开(公告)日:2017-05-23

    申请号:US15188706

    申请日:2016-06-21

    CPC classification number: H01L21/68735 H01L21/324 H01L21/67115 H01L21/68757

    Abstract: Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder includes a hollow cylindrical body comprising an inner peripheral surface, an outer peripheral surface parallel to the inner peripheral surface, wherein the inner peripheral surface and the outer peripheral surface extend along a direction parallel to a longitudinal axis of the support cylinder, and a lateral portion extending radially from the outer peripheral surface to the inner peripheral surface, wherein the lateral portion comprises a first end having a first beveled portion, a first rounded portion, and a first planar portion connecting the first beveled portion and the first rounded portion, and a second end opposing the first end, the second end having a second beveled portion, a second rounded portion, and a second planar portion connecting the second beveled portion and the second rounded portion.

    Thermal reactor with improved gas flow distribution
    5.
    发明授权
    Thermal reactor with improved gas flow distribution 有权
    具有改善气流分布的热反应器

    公开(公告)号:US08888916B2

    公开(公告)日:2014-11-18

    申请号:US14088013

    申请日:2013-11-22

    CPC classification number: H01L21/67115 F27D7/06 H01L21/67017 H01L21/67098

    Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.

    Abstract translation: 本发明的实施例提供了用于改善热处理期间气体分布的装置和方法。 本发明的一个实施例提供了一种用于处理衬底的装置,其包括限定处理体积的室主体,设置在处理容积中的衬底支撑件,其中衬底支撑件构造成支撑和旋转衬底;气体入口组件, 室主体的入口并且被配置为向处理容积提供第一气流,以及联接到室主体的出口的排气组件,其中气体入口组件和排气组件设置在室主体的相对侧上 ,并且排气组件限定了被配置为延长处理量的排气量。

    Substrate processing system, valve assembly, and processing method

    公开(公告)号:US10665476B2

    公开(公告)日:2020-05-26

    申请号:US14335415

    申请日:2014-07-18

    Abstract: In one aspect, a valve assembly adapted to seal an opening in a chamber is disclosed. Valve assembly includes a housing being adapted for coupling to a chamber surface having the opening therein, the housing including a threshold portion positioned adjacent to the chamber opening, the threshold portion having one or more inlets adapted to supply gas to an interior region of the housing adjacent to the chamber opening; and a sealing surface adapted to selectively (1) seal the opening, and (2) retract from the opening so as not to obstruct substrate passage. Numerous other system aspects are provided, as are methods and computer program products in accordance with these and other aspects.

    Support cylinder for thermal processing chamber

    公开(公告)号:US10128144B2

    公开(公告)日:2018-11-13

    申请号:US15600336

    申请日:2017-05-19

    Abstract: Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder includes a hollow cylindrical body comprising an inner peripheral surface, an outer peripheral surface parallel to the inner peripheral surface, wherein the inner peripheral surface and the outer peripheral surface extend along a direction parallel to a longitudinal axis of the support cylinder, and a lateral portion extending radially from the outer peripheral surface to the inner peripheral surface, wherein the lateral portion comprises a first end having a first beveled portion, a first rounded portion, and a first planar portion connecting the first beveled portion and the first rounded portion, and a second end opposing the first end, the second end having a second beveled portion, a second rounded portion, and a second planar portion connecting the second beveled portion and the second rounded portion.

    GRAPHITE SUSCEPTOR
    10.
    发明申请
    GRAPHITE SUSCEPTOR 有权
    石墨切片机

    公开(公告)号:US20160083840A1

    公开(公告)日:2016-03-24

    申请号:US14863063

    申请日:2015-09-23

    CPC classification number: C23C16/4583 C23C16/4581 H01L21/67098 H01L21/68785

    Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.

    Abstract translation: 本文描述的实施例包括用于半导体处理的基座,其包括可以具有至少1mm的厚度的取向石墨板。 基座可以具有支撑构件,并且取向的石墨板可以设置在支撑构件上。 支撑构件可以具有中心热导管和边缘热导管,并且可以在中心热导管和边缘热导管之间基本上是固体的。

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