公开(公告)号：US20180057356A1

公开(公告)日：2018-03-01

申请号：US15649597

申请日：2017-07-13

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/67

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

公开(公告)号：US09725302B1

公开(公告)日：2017-08-08

申请号：US15247717

申请日：2016-08-25

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: H01L27/146 ,  B81B7/00 ,  B81C1/00 ,  H01L21/67

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

公开(公告)号：US20190304756A1

公开(公告)日：2019-10-03

申请号：US16374420

申请日：2019-04-03

Applicant: Applied Materials, Inc.

Inventor： Laksheswar Kalita ,  Soonam Park ,  Toan Q. Tran ,  Lili Ji ,  Dmitry Lubomirsky ,  Akhil Devarakonda ,  Tien Fak Tan ,  Tae Won Kim ,  Saravjeet Singh ,  Alexander Tam ,  Jingchun Zhang ,  Jing J. Zhang

IPC: H01J37/32 ,  C23C4/134 ,  C23C4/11

Abstract: Systems and methods may be used to produce coated components. Exemplary chamber components may include an aluminum, stainless steel, or nickel plate defining a plurality of apertures. The plate may include a hybrid coating, and the hybrid coating may include a first layer comprising a corrosion resistant coating. The first layer may extend conformally through each aperture of the plurality of apertures. The hybrid coating may also include a second layer comprising an erosion resistant coating extending across a plasma-facing surface of the semiconductor chamber component.

公开(公告)号：US10026597B2

公开(公告)日：2018-07-17

申请号：US15397429

申请日：2017-01-03

Applicant: Applied Materials, Inc.

Inventor： Chirantha Rodrigo ,  Jingchun Zhang ,  Lili Ji ,  Anchuan Wang ,  Nitin K. Ingle

IPC: H01J37/32 ,  H01L21/311 ,  C23C16/44 ,  H01L21/67

Abstract: The present disclosure provides methods for cleaning chamber components post substrate etching. In one example, a method for cleaning includes activating an etching gas mixture using a plasma to create an activated etching gas mixture, the etching gas mixture comprising hydrogen-containing precursor and a fluorine-containing precursor and delivering the activated etching gas mixture to a processing region of a process chamber, the process chamber having an edge ring positioned therein, the edge ring comprising a catalyst and anticatalytic material, wherein the activated gas removes the anticatalytic material from the edge ring.

公开(公告)号：US09975758B2

公开(公告)日：2018-05-22

申请号：US15649597

申请日：2017-07-13

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: H01L27/146 ,  B81B7/00 ,  H01L21/67 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.