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公开(公告)号:US20190304756A1
公开(公告)日:2019-10-03
申请号:US16374420
申请日:2019-04-03
Applicant: Applied Materials, Inc.
Inventor: Laksheswar Kalita , Soonam Park , Toan Q. Tran , Lili Ji , Dmitry Lubomirsky , Akhil Devarakonda , Tien Fak Tan , Tae Won Kim , Saravjeet Singh , Alexander Tam , Jingchun Zhang , Jing J. Zhang
Abstract: Systems and methods may be used to produce coated components. Exemplary chamber components may include an aluminum, stainless steel, or nickel plate defining a plurality of apertures. The plate may include a hybrid coating, and the hybrid coating may include a first layer comprising a corrosion resistant coating. The first layer may extend conformally through each aperture of the plurality of apertures. The hybrid coating may also include a second layer comprising an erosion resistant coating extending across a plasma-facing surface of the semiconductor chamber component.
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公开(公告)号:US20190119815A1
公开(公告)日:2019-04-25
申请号:US16167074
申请日:2018-10-22
Applicant: Applied Materials, Inc.
Inventor: Soonam Park , Toan Q. Tran , Nikolai Kalnin , Dmitry Lubomirsky , Akhil Devarakonda
IPC: C23C16/455 , H01L21/3065 , H01L21/311 , H01L21/02
Abstract: Systems and methods may be used to enact plasma filtering. Exemplary processing chambers may include a showerhead. The processing chambers may include a substrate support. The processing chambers may include a power source electrically coupled with the substrate support and configured to provide power to the substrate support to produce a bias plasma within a processing region defined between the showerhead and the substrate support. The processing systems may include a plasma screen coupled with the substrate support and configured to substantially eliminate plasma leakage through the plasma screen. The plasma screen may be coupled with electrical ground.
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