- 专利标题: SYSTEMS AND PROCESSES FOR PLASMA FILTERING
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申请号: US16167074申请日: 2018-10-22
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公开(公告)号: US20190119815A1公开(公告)日: 2019-04-25
- 发明人: Soonam Park , Toan Q. Tran , Nikolai Kalnin , Dmitry Lubomirsky , Akhil Devarakonda
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; H01L21/3065 ; H01L21/311 ; H01L21/02
摘要:
Systems and methods may be used to enact plasma filtering. Exemplary processing chambers may include a showerhead. The processing chambers may include a substrate support. The processing chambers may include a power source electrically coupled with the substrate support and configured to provide power to the substrate support to produce a bias plasma within a processing region defined between the showerhead and the substrate support. The processing systems may include a plasma screen coupled with the substrate support and configured to substantially eliminate plasma leakage through the plasma screen. The plasma screen may be coupled with electrical ground.
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