公开(公告)号：US11088000B2

公开(公告)日：2021-08-10

申请号：US16709684

申请日：2019-12-10

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Benjamin Schwarz ,  Changhun Lee ,  Ping Han Hsieh ,  Adauto Diaz, Jr. ,  Daniel T. McCormick

IPC: H01L21/67 ,  H01L21/66 ,  H01L23/522 ,  H01L23/64

Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.

公开(公告)号：US20180057356A1

公开(公告)日：2018-03-01

申请号：US15649597

申请日：2017-07-13

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/67

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

公开(公告)号：US09725302B1

公开(公告)日：2017-08-08

申请号：US15247717

申请日：2016-08-25

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: H01L27/146 ,  B81B7/00 ,  B81C1/00 ,  H01L21/67

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

公开(公告)号：US10515862B2

公开(公告)日：2019-12-24

申请号：US15480337

申请日：2017-04-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Leonard Tedeschi ,  Benjamin Schwarz ,  Changhun Lee ,  Ping Han Hsieh ,  Adauto Diaz ,  Daniel T. McCormick

IPC: H01L23/58 ,  H01L21/66 ,  H01L21/67 ,  H01L23/522 ,  H01L23/64

Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.

公开(公告)号：US20180294200A1

公开(公告)日：2018-10-11

申请号：US15480337

申请日：2017-04-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Leonard TEDESCHI ,  Benjamin SCHWARZ ,  Changhun LEE ,  Ping Han Hsieh ,  Adauto DIAZ ,  Daniel T. McCormick

IPC: H01L21/66

Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.

公开(公告)号：US09975758B2

公开(公告)日：2018-05-22

申请号：US15649597

申请日：2017-07-13

Applicant: Applied Materials, Inc.

Inventor： Leonard Tedeschi ,  Lili Ji ,  Olivier Joubert ,  Dmitry Lubomirsky ,  Philip Allan Kraus ,  Daniel T. McCormick

IPC: H01L27/146 ,  B81B7/00 ,  H01L21/67 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/047 ,  B81C1/00031 ,  B81C1/00412 ,  C23C16/4401 ,  C23C16/52 ,  H01L21/67288

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.