公开(公告)号：US10154586B2

公开(公告)日：2018-12-11

申请号：US14538733

申请日：2014-11-11

申请人： APPLIED MATERIALS, INC.

发明人： Sriskantharajah Thirunavukarasu ,  Joseph Johnson

IPC分类号： F26B3/30 ,  F25B29/00 ,  H01L29/18 ,  F25B21/02 ,  H05K1/11

摘要： Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via, a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connectors disposed in the plurality of via, and a plurality of solid state light sources disposed on a top surface of the metallic layer and electrically coupled to the metallic layer.

公开(公告)号：US09721802B2

公开(公告)日：2017-08-01

申请号：US14290856

申请日：2014-05-29

申请人： Applied Materials, Inc.

发明人： Subhash Deshmukh ,  Joseph Johnson

IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01L21/3065 ,  H01J37/32 ,  C23F4/00 ,  H01L21/311 ,  H01L21/3213 ,  H05K3/02 ,  H01L21/268 ,  H01L21/02

CPC分类号： H01L21/3065 ,  C23F4/00 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32862 ,  H01J2237/3343 ,  H01L21/02071 ,  H01L21/268 ,  H01L21/2686 ,  H01L21/31116 ,  H01L21/32135 ,  H01L21/32136 ,  H05K3/027

摘要： An apparatus configured to remove metal etch byproducts from the surface of substrates and from the interior of a substrate processing chamber. A plasma is used in combination with a solid state light source, such as an LED, to desorb metal etch byproducts. The desorbed byproducts may then be removed from the chamber.

公开(公告)号：US09543172B2

公开(公告)日：2017-01-10

申请号：US14043091

申请日：2013-10-01

申请人： APPLIED MATERIALS, INC.

发明人： Joseph Johnson ,  Joseph M. Ranish ,  John Gerling ,  Mathew Abraham ,  Aaron Muir Hunter ,  Aneesh Nainani

IPC分类号： F26B19/00 ,  F26B3/30 ,  F21V7/00 ,  F24C7/00 ,  H01L21/67

CPC分类号： H01L21/67115 ,  H01L21/67103 ,  H01L21/67109

摘要： Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

摘要翻译： 本文提供了用于向处理室提供热能的设备。 该装置可以包括处理室的处理室主体，具有多个固态源的固态源阵列，其设置在第一基板上，以向处理室提供热能，以加热设置在处理室中的目标部件 主体和至少一个反射器，其布置在靠近所述多个固态源中的一个或多个固态源的第一基板上，以将由所述多个固态源中的一个或多个的所述固态源提供的热能引导到所述目标部件。

公开(公告)号：US20150099369A1

公开(公告)日：2015-04-09

申请号：US14290861

申请日：2014-05-29

申请人： Applied Materials, Inc.

发明人： Subhash Deshmukh ,  Joseph Johnson ,  Jingjing Liu ,  He Ren

IPC分类号： H01L21/3213 ,  H01L21/268

CPC分类号： H01L21/3065 ,  C23F4/00 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32862 ,  H01J2237/3343 ,  H01L21/02071 ,  H01L21/268 ,  H01L21/2686 ,  H01L21/31116 ,  H01L21/32135 ,  H01L21/32136 ,  H05K3/027

摘要： An apparatus configured to remove metal etch byproducts from the surface of substrates and from the interior of a substrate processing chamber. A plasma is used in combination with a solid state light source, such as an LED, to desorb metal etch byproducts. The desorbed byproducts may then be removed from the chamber.

摘要翻译： 一种被配置为从衬底的表面和从衬底处理室的内部去除金属蚀刻副产物的装置。 将等离子体与固态光源（例如LED）组合使用以解吸金属蚀刻副产物。 然后可以从室中除去解吸的副产物。

公开(公告)号：US20220357665A1

公开(公告)日：2022-11-10

申请号：US17740960

申请日：2022-05-10

申请人： Applied Materials, Inc.

发明人： Joseph Johnson ,  Christopher Bencher

IPC分类号： G03F7/20

摘要： Methods, systems and apparatus for decreasing total distortion of a maskless lithography process are disclosed. Some embodiments provide methods, systems and apparatus for decreasing total distortion without physical modification of the apparatus.

公开(公告)号：US20150096683A1

公开(公告)日：2015-04-09

申请号：US14290856

申请日：2014-05-29

申请人： Applied Materials, Inc.

发明人： Subhash Deshmukh ,  Joseph Johnson

IPC分类号： H01J37/32

CPC分类号： H01L21/3065 ,  C23F4/00 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32862 ,  H01J2237/3343 ,  H01L21/02071 ,  H01L21/268 ,  H01L21/2686 ,  H01L21/31116 ,  H01L21/32135 ,  H01L21/32136 ,  H05K3/027

摘要： An apparatus configured to remove metal etch byproducts from the surface of substrates and from the interior of a substrate processing chamber. A plasma is used in combination with a solid state light source, such as an LED, to desorb metal etch byproducts. The desorbed byproducts may then be removed from the chamber.

摘要翻译： 一种被配置为从衬底的表面和从衬底处理室的内部去除金属蚀刻副产物的装置。 将等离子体与固态光源（例如LED）组合使用以解吸金属蚀刻副产物。 然后可以从室中除去解吸的副产物。

公开(公告)号：US20140273504A1

公开(公告)日：2014-09-18

申请号：US13838960

申请日：2013-03-15

申请人： APPLIED MATERIALS, INC.

发明人： Aneesh Nainani ,  Joseph Johnson ,  Er-Xuan Ping ,  Adam Brand ,  Mathew Abraham

IPC分类号： H01L21/02 ,  H01L21/285

CPC分类号： H01L21/02277 ,  C23C16/047 ,  C23C16/405 ,  C23C16/45525 ,  C23C16/482 ,  C23C16/505 ,  H01L21/02181 ,  H01L21/02274 ,  H01L21/28194 ,  H01L21/28562 ,  H01L21/76849 ,  H01L21/76879 ,  H01L29/517 ,  H01L29/66545

摘要： A substrate processing chamber comprising a chamber wall enclosing a process zone having an exhaust port, a substrate support to support a substrate in the process zone, a gas distributor for providing a deposition gas to the process zone, a solid state light source capable of irradiating substantially the entire surface of the substrate with light, and a gas energizer for energizing the deposition gas.

摘要翻译： 一种衬底处理室，包括一个封闭一个具有排气口的工艺区域的腔室壁，一个用于在工艺区域中支撑衬底的衬底支撑件，一个用于向工艺区域提供沉积气体的气体分配器，能够照射 基本上具有光的基板的整个表面，以及用于激发沉积气体的气体激发器。

公开(公告)号：US11822253B2

公开(公告)日：2023-11-21

申请号：US17740960

申请日：2022-05-10

申请人： Applied Materials, Inc.

发明人： Joseph Johnson ,  Christopher Bencher

IPC分类号： G03F7/20 ,  G03F7/00

CPC分类号： G03F7/7055

摘要： Methods, systems and apparatus for decreasing total distortion of a maskless lithography process are disclosed. Some embodiments provide methods, systems and apparatus for decreasing total distortion without physical modification of the apparatus.

公开(公告)号：US09318360B2

公开(公告)日：2016-04-19

申请号：US14465482

申请日：2014-08-21

申请人： Applied Materials, Inc.

发明人： Joseph Johnson ,  Joseph M. Ranish

IPC分类号： F21V21/00 ,  H01L21/67

CPC分类号： F26B3/30 ,  F21K9/20 ,  H01L21/67115

摘要： Apparatus for providing energy to a process chamber are provided herein. In one embodiment, the apparatus include a supporting substrate, a first plurality of solid state light sources disposed on a first surface of the supporting substrate, and a second plurality of solid state light sources disposed on the top surface of the supporting substrate, wherein the first and second plurality of solid state light sources are aligned and electrically isolated from each other, and the first plurality of solid state light sources is in physical contact with the second plurality of solid state light sources.

公开(公告)号：US09140647B2

公开(公告)日：2015-09-22

申请号：US14543649

申请日：2014-11-17

申请人： Applied Materials, Inc.

发明人： Joseph M. Ranish ,  Joseph Johnson ,  Mehran Behdjat

IPC分类号： G01N21/55 ,  G01N21/47

CPC分类号： G01N21/55 ,  G01N21/4738 ,  G01N2201/08

摘要： An apparatus for reflectivity measurement is provided. The apparatus generally measures reflectivity characteristics of a reflective surface, such as a reflective cavity of a light array. The apparatus generally comprises a body defining a volume and a light emitting element disposed outside the volume. A sensor coupled to the body detects light reflected from a reflective surface. Various embodiments provide positioning of the apparatus relative to a light array having a reflective cavity.

摘要翻译： 提供了一种用于反射率测量的装置。 该装置通常测量反射表面的反射率特性，例如光阵列的反射腔。 该装置通常包括限定体积的体和设置在体积外的发光元件。 耦合到身体的传感器检测从反射表面反射的光。 各种实施例提供了装置相对于具有反射腔的光阵列的定位。