公开(公告)号：US20190390322A1

公开(公告)日：2019-12-26

申请号：US15749023

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel DIEGUEZ-CAMPO ,  Harald WURSTER ,  Uwe SCHÜSSLER

IPC: C23C14/24

Abstract: A material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material deposition arrangement includes at least one material deposition source having a crucible configured to evaporate the material, a distribution assembly configured for providing the evaporated material to the substrate, and a force application device configured for applying a contact force at a connection between the crucible and the distribution assembly.

公开(公告)号：US20240247362A1

公开(公告)日：2024-07-25

申请号：US18558817

申请日：2021-05-21

Applicant: Applied Materials, Inc.

Inventor： Julian AULBACH ,  Andreas MÜLLER ,  Harald WURSTER ,  Andreas LOPP ,  David Friedrich FREIHERR VON LINDENFELS ,  Takashi ANJIKI

IPC: C23C14/24 ,  C23C14/12

CPC classification number: C23C14/243 ,  C23C14/12

Abstract: A nozzle for an evaporated material distributor is described. The nozzle includes a nozzle inlet for receiving evaporated material; a nozzle outlet; and a nozzle passage extending between the nozzle inlet and the nozzle outlet having a first passage portion, a second passage portion and a third passage portion, the second passage portion having an aperture angle which continuously increases in a direction from the nozzle inlet to the nozzle outlet and the third passage portion having an essentially constant aperture angle.

公开(公告)号：US20190148642A1

公开(公告)日：2019-05-16

申请号：US16300484

申请日：2016-05-10

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel DIEGUEZ-CAMPO ,  Stefan BANGERT ,  Andreas LOPP ,  Harald WURSTER ,  Dieter HAAS

IPC: H01L51/00 ,  C23C14/12 ,  C23C14/04 ,  C23C14/24 ,  H01L51/56

CPC classification number: H01L51/0011 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C23C14/243 ,  C23C14/564 ,  H01L51/001 ,  H01L51/56

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.