公开(公告)号：US20210305020A1

公开(公告)日：2021-09-30

申请号：US16829993

申请日：2020-03-25

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Arun Kumar Kotrappa ,  Hanish Panavalappil Kumarankutty Kumar ,  Ramcharan Sundar

IPC: H01J37/32

Abstract: Embodiments disclosed herein include an RF return assembly. In an embodiment, the RF return assembly comprises a first plate with a flange, where a first hole and a second hole pass through the flange. The RF return assembly may further comprise a second plate over the first plate, and a first body positioned above the flange. In an embodiment, the RF return assembly further comprises a second body positioned below the flange, where the first body is affixed to the second body by a pillar that passes through the first hole. In an embodiment, the RF return assembly further comprises a spring attached between the second plate and the second body, where the spring passes through the second hole, and a conductive band to electrically couple the first body to the flange.

公开(公告)号：US20240096605A1

公开(公告)日：2024-03-21

申请号：US17946947

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Arun Kumar Kotrappa ,  CHANDRASHEKARA BAGINAGERE ,  RAMCHARAN SUNDAR ,  SEYYED FAZELI ,  ANANTHA SUBRAMANI ,  SIYU ZHU ,  AKHIL SINGHAL ,  PHILIP ALLAN KRAUS

IPC: H01J37/32 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/505 ,  H01L21/687

CPC classification number: H01J37/32715 ,  C23C16/4412 ,  C23C16/45565 ,  C23C16/4584 ,  C23C16/46 ,  C23C16/505 ,  H01J37/32449 ,  H01J37/32834 ,  H01L21/68742 ,  H01J37/32082 ,  H01J2237/20207 ,  H01J2237/20214 ,  H01J2237/332

Abstract: Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, a pedestal in the chamber, and a first gas feed system on a first side of the pedestal. In an embodiment, the first gas feed system comprises a first exhaust line with a first valve to open and close the first exhaust line, and a first source gas feed line with a second valve to open and close the first source gas feed line. In an embodiment, the semiconductor processing tool further comprises a second gas feed system on a second side of the pedestal. In an embodiment, the second gas feed system comprises a second exhaust line with a third valve to open and close the second exhaust line, and a second source gas feed line with a fourth valve to open and close the second source gas feed line.

公开(公告)号：US20220307131A1

公开(公告)日：2022-09-29

申请号：US17213908

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Seyyed Abdolreza Fazeli ,  Yang Guo ,  Ramcharan Sundar ,  Arun Kumar Kotrappa ,  Steven Mosbrucker ,  Steven D. Marcus ,  Xinhai Han ,  Kesong Hu ,  Tianyang Li ,  Philip A. Kraus

IPC: C23C16/455 ,  C23C16/458 ,  H01J37/32 ,  C23C14/56

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

公开(公告)号：US11946140B2

公开(公告)日：2024-04-02

申请号：US17213908

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Seyyed Abdolreza Fazeli ,  Yang Guo ,  Ramcharan Sundar ,  Arun Kumar Kotrappa ,  Steven Mosbrucker ,  Steven D. Marcus ,  Xinhai Han ,  Kesong Hu ,  Tianyang Li ,  Philip A. Kraus

IPC: C23C16/455 ,  C23C14/56 ,  C23C16/458 ,  H01J37/32

CPC classification number: C23C16/45565 ,  C23C14/564 ,  C23C16/45536 ,  C23C16/4586 ,  H01J37/32082

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

公开(公告)号：US20230282506A1

公开(公告)日：2023-09-07

申请号：US17685272

申请日：2022-03-02

Applicant: Applied Materials, Inc.

Inventor： Anantha Subramani ,  Yang Guo ,  Seyyed Fazeli ,  Ramcharan Sundar ,  Arun Kumar Kotrappa

IPC: H01L21/683 ,  H01J37/32 ,  C23C14/28 ,  C23C14/50

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  C23C14/28 ,  C23C14/505 ,  H01J2237/2007 ,  H01J2237/20214 ,  H01J2237/20235 ,  H01J2237/332

Abstract: Embodiments disclosed herein include an electrostatic chuck. In an embodiment, the electrostatic chuck comprises a pedestal with a support surface for supporting a substrate and a second surface opposite from the support surface, and chucking electrode within the pedestal. In an embodiment, a biasing electrode is within the pedestal, and a heating element is within the pedestal. In an embodiment, the electrostatic chuck further comprises a shaft coupled to the second surface of the pedestal, and a rotation assembly coupled to the shaft to rotate the shaft and the pedestal.

公开(公告)号：US11335543B2

公开(公告)日：2022-05-17

申请号：US16829993

申请日：2020-03-25

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Arun Kumar Kotrappa ,  Hanish Panavalappil Kumarankutty Kumar ,  Ramcharan Sundar

IPC: H01J37/32

Abstract: Embodiments disclosed herein include an RF return assembly. In an embodiment, the RF return assembly comprises a first plate with a flange, where a first hole and a second hole pass through the flange. The RF return assembly may further comprise a second plate over the first plate, and a first body positioned above the flange. In an embodiment, the RF return assembly further comprises a second body positioned below the flange, where the first body is affixed to the second body by a pillar that passes through the first hole. In an embodiment, the RF return assembly further comprises a spring attached between the second plate and the second body, where the spring passes through the second hole, and a conductive band to electrically couple the first body to the flange.