公开(公告)号：US20250159829A1

公开(公告)日：2025-05-15

申请号：US19025650

申请日：2025-01-16

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/24 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20230211625A1

公开(公告)日：2023-07-06

申请号：US18183825

申请日：2023-03-14

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H04M1/02

CPC classification number: H04M1/0249

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20190327846A1

公开(公告)日：2019-10-24

申请号：US16404498

申请日：2019-05-06

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23P17/00 ,  H05K5/02 ,  H05K13/00 ,  C25D7/00 ,  C25D11/02 ,  H05K5/03 ,  H01Q1/42 ,  C25D11/12 ,  C25D11/34 ,  B23P17/02 ,  B23C5/00 ,  H04M1/11 ,  B23C5/10 ,  H01Q1/24 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20240188243A1

公开(公告)日：2024-06-06

申请号：US18438822

申请日：2024-02-12

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/24 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  C25D11/246 ,  H04M1/0249 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20220117106A1

公开(公告)日：2022-04-14

申请号：US17645709

申请日：2021-12-22

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20210022261A1

公开(公告)日：2021-01-21

申请号：US17032956

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20190021180A1

公开(公告)日：2019-01-17

申请号：US16042992

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20240431057A1

公开(公告)日：2024-12-26

申请号：US18830855

申请日：2024-09-11

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/24 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20180242470A1

公开(公告)日：2018-08-23

申请号：US15958915

申请日：2018-04-20

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN ,  Michael P. COLEMAN ,  Thomas JOHANNESSEN ,  Richard W. HELEY

IPC: H05K5/04 ,  B23C5/00

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20150351273A1

公开(公告)日：2015-12-03

申请号：US14821620

申请日：2015-08-07

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC: H05K5/04 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract translation: 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。