公开(公告)号：US20130326851A1

公开(公告)日：2013-12-12

申请号：US13607636

申请日：2012-09-07

申请人： Apple Inc.

发明人： Charles B. WOODHULL ,  Ashley N. Saulsbury ,  Nicholas I. Reid ,  Phillip W. Hum ,  Vashist Vasanthakumar

IPC分类号： B23Q17/00

CPC分类号： G05B19/19 ,  G05B19/41805 ,  G05B19/41865 ,  G05B2219/31036 ,  G05B2219/31049 ,  G05B2219/37212 ,  G06Q10/06 ,  Y02P90/04 ,  Y02P90/20 ,  Y02P90/265 ,  Y10T29/49764

摘要： A manufacturing process for providing an assembly formed of a first piece and a second piece is described. The manufacturing process is carried out by performing at least the following operations: receiving the first piece characterized in accordance with at least a first attribute, selecting the second piece from a buffer, the selecting based in part upon a matching value of a second attribute in relation to the first attribute, replacing the selected second piece with another second piece such that the number of second pieces in the buffer remains about the same, and forming a kit of the first part and the selected second part.

摘要翻译： 描述了一种用于提供由第一件和第二件形成的组件的制造工艺。 通过至少执行以下操作来执行制造过程：接收根据至少第一属性表征的第一件，从缓冲器中选择第二件，部分地基于第二件的匹配值进行选择 与第一属性的关系，用另一个第二部分替换所选择的第二片，使得缓冲器中的第二片的数量保持大致相同，并且形成第一部分和所选择的第二部分的套件。

公开(公告)号：US20160330852A1

公开(公告)日：2016-11-10

申请号：US15217605

申请日：2016-07-22

申请人： Apple Inc.

发明人： Lucy Elizabeth BROWNING ,  Charles B. WOODHULL ,  Bryan Patrick KIPLE ,  David A. PAKULA ,  Tang Yew TAN ,  Julie HANCHAK-CONNORS ,  John Murray THORNTON, III ,  Thomas JOHANNESSEN ,  Peter RUSSELL-CLARKE ,  Masashige TATEBE ,  Napthaneal Y. TAN

IPC分类号： H05K5/02 ,  C25D11/12 ,  C25D11/02 ,  H05K5/04

CPC分类号： H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

摘要： Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

摘要翻译： 描述了用于形成保护和美容地增强金属表面的阳极氧化层的方法和结构。 在一些实施方案中，方法包括在下面的金属上形成阳极氧化层，其允许下面的金属表面是可见的。 在一些实施例中，方法包括在倾斜表面上形成第一阳极氧化层和相邻的第二阳极氧化层，两个阳极氧化层之间的界面是规则的和均匀的。 描述的是光掩模技术和工具，用于在金属表面上阳极化和纹理化图案上提供锐利定义的角。 还描述了在电子设备的制造中提供耐阳极化部件的技术和工具。

公开(公告)号：US20230211625A1

公开(公告)日：2023-07-06

申请号：US18183825

申请日：2023-03-14

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H04M1/02

CPC分类号： H04M1/0249

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20190327846A1

公开(公告)日：2019-10-24

申请号：US16404498

申请日：2019-05-06

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23P17/00 ,  H05K5/02 ,  H05K13/00 ,  C25D7/00 ,  C25D11/02 ,  H05K5/03 ,  H01Q1/42 ,  C25D11/12 ,  C25D11/34 ,  B23P17/02 ,  B23C5/00 ,  H04M1/11 ,  B23C5/10 ,  H01Q1/24 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20180242470A1

公开(公告)日：2018-08-23

申请号：US15958915

申请日：2018-04-20

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN ,  Michael P. COLEMAN ,  Thomas JOHANNESSEN ,  Richard W. HELEY

IPC分类号： H05K5/04 ,  B23C5/00

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20150351273A1

公开(公告)日：2015-12-03

申请号：US14821620

申请日：2015-08-07

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  H05K5/03

CPC分类号： H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

摘要翻译： 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。

公开(公告)号：US20240188243A1

公开(公告)日：2024-06-06

申请号：US18438822

申请日：2024-02-12

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/24 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00

CPC分类号： H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  C25D11/246 ,  H04M1/0249 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20220117106A1

公开(公告)日：2022-04-14

申请号：US17645709

申请日：2021-12-22

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20210022261A1

公开(公告)日：2021-01-21

申请号：US17032956

申请日：2020-09-25

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20190021180A1

公开(公告)日：2019-01-17

申请号：US16042992

申请日：2018-07-23

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.