公开(公告)号：US20180242470A1

公开(公告)日：2018-08-23

申请号：US15958915

申请日：2018-04-20

Applicant: Apple Inc.

Inventor： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN ,  Michael P. COLEMAN ,  Thomas JOHANNESSEN ,  Richard W. HELEY

IPC: H05K5/04 ,  B23C5/00

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.