公开(公告)号：US20240088032A1

公开(公告)日：2024-03-14

申请号：US17932182

申请日：2022-09-14

申请人： Apple Inc.

发明人： Vidhya Ramachandran ,  Chi Nung Ni ,  Chueh-An Hsieh ,  Rekha Govindaraj ,  Jun Zhai ,  Long Huang ,  Rohan U. Mandrekar ,  Saumya K. Gandhi ,  Zhuo Yan ,  Yizhang Yang ,  Saurabh P. Sinha ,  Antonietta Oliva

IPC分类号： H01L23/528 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L49/02

CPC分类号： H01L23/5283 ,  H01L23/481 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/16 ,  H01L28/40 ,  H01L2224/08265 ,  H01L2224/16225

摘要： Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.

公开(公告)号：US20240063715A1

公开(公告)日：2024-02-22

申请号：US17820168

申请日：2022-08-16

申请人： Apple Inc.

发明人： Alexander B. Uan-Zo-li ,  Shuai Jiang ,  Jamie L. Langlinais ,  Per H. Hammarlund ,  Hans L. Yeager ,  Victor Zyuban ,  Sung J. Kim ,  Wei Xu ,  Rohan U. Mandrekar ,  Sambasivan Narayan ,  Mohamed H. Abu-Rahma ,  Jaroslav Raszka ,  Robert O. Bruckner

IPC分类号： H02M3/07 ,  H02M1/00

CPC分类号： H02M3/07 ,  H02M1/0067

摘要： A power delivery sub-system included in a computer system employs a primary voltage regulator circuit that generates a primary supply voltage on a primary power supply node. The power delivery sub-system also includes multiple bypass voltage regulator circuits that source corresponding bypass currents to a local power supply nodes in an integrated circuit. The integrated circuit includes multiple circuit blocks coupled to corresponding ones of the local power supply nodes, and multiple local voltage regulator circuits coupled to the primary power supply node. When a voltage level of a given local power supply node drops below a threshold value, a corresponding local voltage regulator circuit sources a supply current to the given local power supply node.

公开(公告)号：US20200176427A1

公开(公告)日：2020-06-04

申请号：US16205679

申请日：2018-11-30

申请人： Apple Inc.

发明人： Vidhya Ramachandran ,  Chonghua Zhong ,  Jun Zhai ,  Long Huang ,  Mengzhi Pang ,  Rohan U. Mandrekar

IPC分类号： H01L25/16 ,  H01L21/66 ,  G01R31/02

摘要： Integrated passive devices (IPDs), electronic packaging structures, and methods of testing IPDs are described. In an embodiment, an electronic package structure includes an IPD with an array of capacitor banks that are electrically separate in the IPD, and a package routing that includes an interconnect electrically connected to an IC and a plurality of the capacitor banks in parallel.

公开(公告)号：US11069665B2

公开(公告)日：2021-07-20

申请号：US16205679

申请日：2018-11-30

申请人： Apple Inc.

发明人： Vidhya Ramachandran ,  Chonghua Zhong ,  Jun Zhai ,  Long Huang ,  Mengzhi Pang ,  Rohan U. Mandrekar

IPC分类号： H01L25/16 ,  G01R31/64 ,  H01L23/525 ,  H01L21/66 ,  H01L49/02

摘要： Integrated passive devices (IPDs), electronic packaging structures, and methods of testing IPDs are described. In an embodiment, an electronic package structure includes an IPD with an array of capacitor banks that are electrically separate in the IPD, and a package routing that includes an interconnect electrically connected to an IC and a plurality of the capacitor banks in parallel.