公开(公告)号：US20240088032A1

公开(公告)日：2024-03-14

申请号：US17932182

申请日：2022-09-14

申请人： Apple Inc.

发明人： Vidhya Ramachandran ,  Chi Nung Ni ,  Chueh-An Hsieh ,  Rekha Govindaraj ,  Jun Zhai ,  Long Huang ,  Rohan U. Mandrekar ,  Saumya K. Gandhi ,  Zhuo Yan ,  Yizhang Yang ,  Saurabh P. Sinha ,  Antonietta Oliva

IPC分类号： H01L23/528 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L49/02

CPC分类号： H01L23/5283 ,  H01L23/481 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/16 ,  H01L28/40 ,  H01L2224/08265 ,  H01L2224/16225

摘要： Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.