公开(公告)号：US20160150131A1

公开(公告)日：2016-05-26

申请号：US14550590

申请日：2014-11-21

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Prakash Venkatesappa ,  Annabelle Q. Yang ,  Melvin C. Cabonegro

IPC: H04N5/225 ,  B29C65/00

CPC classification number: H04N5/2254 ,  G03B17/00 ,  G03B29/00 ,  H04M1/0264 ,  H04N5/2253

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

Abstract translation: 图像传感器装置包括基板，模具和位于基板和模具之间的粘合剂层。 基板包括具有弯曲表面的第一侧。 模具包括附着到基板的弯曲表面的图像传感器部件。 包括图像传感器部件的管芯的至少一部分具有弯曲表面。 位于基板的弯曲表面和模具之间的粘合剂层提供了在模具和基板之间的固定附着。

公开(公告)号：US20150228529A1

公开(公告)日：2015-08-13

申请号：US14179779

申请日：2014-02-13

Applicant: Apple Inc.

Inventor： Gerard Anthony C. Afable ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kok Peng Teo ,  Annabelle Q. Yang

IPC: H01L21/687 ,  H01L23/00

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L27/14618 ,  H01L2224/73204 ,  H01L2224/75343 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81206 ,  H01L2224/83104 ,  H01L2224/95 ,  H01L2924/15153 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2224/81 ,  H01L2924/00014

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract translation: 一种用于在超声波安装过程中将衬底固定在衬底载体内的方法和夹紧装置。 夹持装置可以包括具有顶板和底板的基板载体，顶板和底板形成尺寸适于保持基板的空腔。 夹板位于与底板相对的顶板的一侧上，夹板具有与空腔对准的开口和一对夹紧构件，每对夹紧构件中的每一个夹紧构件朝向开口的中心延伸并且通过 所述空腔使得所述夹紧构件将通过所述开口暴露的所述基板的部分压靠在所述底板上。 该方法可以包括提供具有开口的夹持板，所述开口被配置为与形成在基板载体中的空腔对准并将一对弹性臂安装到夹紧板。

公开(公告)号：US10447900B2

公开(公告)日：2019-10-15

申请号：US14820485

申请日：2015-08-06

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kolan Ravi Kanth

IPC: H04N5/225 ,  H05K1/18

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

公开(公告)号：US09443819B2

公开(公告)日：2016-09-13

申请号：US14179779

申请日：2014-02-13

Applicant: Apple Inc.

Inventor： Gerard Anthony C. Afable ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kok Peng Teo ,  Annabelle Q. Yang

IPC: H01L23/00 ,  H01L27/146

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L27/14618 ,  H01L2224/73204 ,  H01L2224/75343 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81206 ,  H01L2224/83104 ,  H01L2224/95 ,  H01L2924/15153 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2224/81 ,  H01L2924/00014

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract translation: 一种用于在超声波安装过程中将衬底固定在衬底载体内的方法和夹紧装置。 夹紧装置可以包括具有顶板和底板的基板载体，顶板和底板形成尺寸适于保持基板的空腔。 夹板位于与底板相对的顶板的一侧上，夹板具有与空腔对准的开口和一对夹紧构件，每对夹紧构件中的每一个夹紧构件朝向开口的中心延伸并且通过 所述空腔使得所述夹紧构件将通过所述开口暴露的所述基板的部分压靠在所述底板上。 该方法可以包括提供具有开口的夹持板，所述开口被配置为与形成在基板载体中的空腔对准并将一对弹性臂安装到夹紧板。

公开(公告)号：US11128786B2

公开(公告)日：2021-09-21

申请号：US14550590

申请日：2014-11-21

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Prakash Venkatesappa ,  Annabelle Q. Yang ,  Melvin C. Cabonegro

IPC: H04N5/225 ,  G03B17/00 ,  G03B29/00 ,  H04M1/02

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

公开(公告)号：US20170041513A1

公开(公告)日：2017-02-09

申请号：US14820485

申请日：2015-08-06

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kolan Ravi Kanth

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Abstract translation: 相机模块包括图像传感器，柔性印刷电路，其具有固定到图像传感器的第一侧的第一侧，固定到图像传感器的第二侧的多个金属引线，以及用于将光引导到 图像传感器通过连接到引线和柔性印刷电路的包覆成型中的一个或多个连接到图像传感器。 图像传感器的第一侧是与图像传感器的第二侧相对的一侧。 引线提供图像传感器和柔性印刷电路中的引线之间的连接。