-
公开(公告)号：US20140084454A1
公开(公告)日：2014-03-27
申请号：US13629560
申请日：2012-09-27
Applicant: APPLE INC.
Inventor： Shawn X. ARNOLD , Matthew E. LAST
IPC: H01L21/762 , H01L23/498
CPC classification number: H01L21/762 , H01L23/498 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/26 , H01L25/0655 , H01L25/0657 , H01L29/0657 , H01L2224/0401 , H01L2224/04026 , H01L2224/06183 , H01L2224/131 , H01L2224/13144 , H01L2224/14183 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/81141 , H01L2224/83141 , H01L2225/06513 , H01L2225/06527 , H01L2225/06551 , H01L2225/06593 , H01L2924/0002 , H01L2924/10156 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A direct multiple substrate die assembly can include a first and a second substrate, wherein each substrate can include at least one interlocking edge feature. An electrical interconnection area can be formed adjacent to or within the interlocking edge feature on each substrate and can be configured to couple one or more electrical signals between the substrates. In one embodiment, the interlocking edge feature can include one or more keying features that can enable accurate alignment between the substrates. In yet another embodiment, the direct multiple substrate die assembly can be mounted out of plane with respect to a supporting substrate.
Abstract translation: 直接多基板模具组件可以包括第一和第二基板，其中每个基板可以包括至少一个互锁边缘特征。 电互连区域可以形成在每个基板上的互锁边缘特征附近或内部，并且可以被配置为在基板之间耦合一个或多个电信号。 在一个实施例中，互锁边缘特征可以包括能够实现基板之间的精确对准的一个或多个键控特征。 在另一个实施例中，直接多基板模具组件可以相对于支撑基板安装在平面外。
-
公开(公告)号：US20150020173A1
公开(公告)日：2015-01-15
申请号：US14444914
申请日：2014-07-28
Applicant: Apple Inc.
Inventor： Matthew E. LAST
CPC classification number: H04W12/06 , G06F21/35 , H04L63/083 , H04L63/0876 , H04L63/101 , H04W12/08
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
Abstract translation: 解锁锁定设备的方法包括：通过无线通信协议接收设备标识符，确定设备标识符是否与可信设备列表相关联，基于该确定发送通过无线通信协议生成声信号的请求， 接收声信号作为在锁定设备外部产生的音频声音，估计音频声源和锁定设备之间的距离，以及基于该估计来解锁锁定的设备。
-
公开(公告)号：US20140091439A1
公开(公告)日：2014-04-03
申请号：US13631769
申请日：2012-09-28
Applicant: APPLE INC.
Inventor： Shawn X. ARNOLD , Matthew E. LAST
IPC: H01L29/02 , H01L21/78 , H01L21/762
CPC classification number: H01L29/0657 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L21/822 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
Abstract: One embodiment for forming a shaped substrate for an electronic device can form a shaped perimeter to define the substrate shape on the surface of a substrate. The shaped perimeter can extend at least part way into the substrate. A subsequent thinning process can remove substrate material and expose the shaped perimeter effectively forming shaped dies from the substrate.
Abstract translation: 用于形成用于电子器件的成形衬底的一个实施例可以形成成形周边以限定衬底表面上的衬底形状。 成形的周边可以至少部分地延伸到基底中。 随后的变薄过程可以去除衬底材料并且使形状的周边有效地从衬底形成成形的模具。
-
公开(公告)号：US20230409691A1
公开(公告)日：2023-12-21
申请号：US18457250
申请日：2023-08-28
Applicant: Apple Inc.
Inventor： Matthew E. LAST
CPC classification number: G06F21/35 , H04L63/083 , H04L63/0876 , H04L63/101 , H04W12/06 , H04W12/08
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
-
公开(公告)号：US20210382977A1
公开(公告)日：2021-12-09
申请号：US17356491
申请日：2021-06-23
Applicant: Apple Inc.
Inventor： Matthew E. LAST
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
-
Patent Agency Ranking
公开(公告)号：US20240370548A1
公开(公告)日：2024-11-07
申请号：US18778192
申请日：2024-07-19
Applicant: Apple Inc.
Inventor： Matthew E. LAST
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
-
公开(公告)号：US20130285240A1
公开(公告)日：2013-10-31
申请号：US13842092
申请日：2013-03-15
Applicant: APPLE INC.
Inventor： Matthew E. LAST , Lili HUANG , Seung Jae HONG , Ralph E. KAUFFMAN , Tongbi Tom JIANG
CPC classification number: H01L23/481 , H01L21/485 , H01L24/05 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/04042 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48464 , H01L2224/48465 , H01L2224/48479 , H01L2224/85051 , H01L2224/85186 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H01L2924/00 , H01L2924/20752 , H01L2224/45099 , H01L2924/00012 , H01L2224/48471 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.
Abstract translation: 传感器阵列封装可以包括设置在基板的第一侧上的传感器。 信号沟槽可以沿着衬底的边缘形成，并且导电层可以沉积在信号沟槽中并且可以耦合到传感器信号焊盘。 接合线可以附接到导电层并且可以被布置成在传感器的表面下方。 传感器阵列封装可嵌入印刷电路板中，使得接合线能够终止于印刷电路板内的其它导体。
-
公开(公告)号：US20180324586A1
公开(公告)日：2018-11-08
申请号：US15972068
申请日：2018-05-04
Applicant: Apple Inc.
Inventor： Matthew E. LAST
CPC classification number: H04W12/06 , G06F21/35 , H04L63/083 , H04L63/0876 , H04L63/101 , H04W12/08
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
-
公开(公告)号：US20180304727A1
公开(公告)日：2018-10-25
申请号：US15758660
申请日：2016-09-01
Applicant: APPLE INC.
Inventor： Hyungryul J. CHOI , Arthur Y. ZHANG , Cheng CHEN , Graham B. MYHRE , Malcolm J. NORTHCOTT , Matheen M. SIDDIQUI , Russell Y. WEBB , Matthew E. LAST
IPC: B60J3/04 , B60J3/06 , B60R16/037
CPC classification number: B60J3/04 , B60J3/06 , B60R16/037
Abstract: A vehicle may have optical structures such as windows and mirrors that have the potential to allow glare from external objects to shine into the eyes of a driver or other vehicle occupant. A control circuit may gather information on where the eyes of the driver are located using a camera mounted in the vehicle and may gather information on where the sun or other source of glare are located outside of the vehicle. Based on this information, the control circuit may direct a light modulator on a window or mirror to selectively darken an area that prevents the glare from reaching the eyes of the driver. The light modulator may have a photochromic layer that is adjusted by shining light onto the photochromic layer, may be a liquid crystal modulator, an electrochromic modulator, or other light modulator layer.
-
公开(公告)号：US20140084425A1
公开(公告)日：2014-03-27
申请号：US13629544
申请日：2012-09-27
Applicant: APPLE INC.
Inventor： Shawn X. ARNOLD , Matthew E. LAST
IPC: H01L23/498 , H01L21/56
CPC classification number: H01L24/19 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L23/5389 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
Abstract: One embodiment of a perimeter trench sensor array package can include a thinned substrate device that includes a perimeter trench formed near the edges of the device that can be configured to be thinner than a central portion of the thinned substrate device. The perimeter trench can include bond pads that can couple to electrical elements included in the thinned substrate device. The thinned substrate device can be attached to a core layer that can in turn support one or more resin layers. The core layer and the resin layers can form a printed circuit board assembly, a flex cable assembly or a stand-alone module.
Abstract translation: 周边沟槽传感器阵列封装的一个实施例可以包括减薄的衬底器件，其包括在器件边缘附近形成的周边沟槽，该周边沟槽可以被配置为比薄的衬底器件的中心部分更薄。 周边沟槽可以包括可以耦合到包括在薄化衬底器件中的电气元件的接合焊盘。 可以将薄化的衬底装置附接到可以依次支撑一个或多个树脂层的芯层。 芯层和树脂层可以形成印刷电路板组件，柔性电缆组件或独立模块。
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.016 seconds)
