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公开(公告)号：US10051724B1
公开(公告)日：2018-08-14
申请号：US14610872
申请日：2015-01-30
Applicant: Apple Inc.
Inventor： Derryk C. Davis , John M. Brock , Peteris K. Augenbergs
Abstract: Embodiments disclosed herein relate to an apparatus that provides structural support and an electrical ground for components of an electronic device. Specifically, one or more embodiments of the present disclosure provide a semi-rigid member having at least one screw boss. An electronic component is coupled to the semi-rigid member. In embodiments, the electronic component is coupled to the semi-rigid member using the at least one screw boss. As a separate component, the semi-rigid member is configured to provide an electrical ground for the electronic component and also provides structural support for the electronic component.
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公开(公告)号：US09772688B2
公开(公告)日：2017-09-26
申请号：US15045628
申请日：2016-02-17
Applicant: Apple Inc.
Inventor： Dhaval Chandrakant Patel , Jonah A. Harley , Peteris K. Augenbergs , Derryk C. Davis , Scott J. McEuen , John M. Brock
CPC classification number: G06F3/016 , G06F1/169 , G06F3/03547 , G06F3/041 , G06F3/0414 , G06F2203/04103 , G06F2203/04105 , H01F7/126 , H05K3/325 , H05K2201/10409
Abstract: A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.
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公开(公告)号：US20230030746A1
公开(公告)日：2023-02-02
申请号：US17387093
申请日：2021-07-28
Applicant: Apple Inc.
Inventor： Ashish K. Sahoo , Brandon Pierquet , Derryk C. Davis , Javier Ruiz , John M. Brock
IPC: H01L29/20 , H01L23/31 , H01L23/36 , H01L23/14 , H01L23/522 , H01L23/532 , H01L27/088
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.
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Patent Agency Ranking
公开(公告)号：US09939901B2
公开(公告)日：2018-04-10
申请号：US14792267
申请日：2015-07-06
Applicant: Apple Inc.
Inventor： Dhaval Chandrakant Patel , Jonah A. Harley , Peteris K. Augenbergs , Derryk C. Davis , Scott J. McEuen , John M. Brock
CPC classification number: G06F3/016 , G06F1/169 , G06F3/03547 , G06F3/041 , G06F3/0414 , G06F2203/04103 , G06F2203/04105 , H01F7/126 , H05K3/325 , H05K2201/10409
Abstract: A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.
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公开(公告)号：US20160091972A1
公开(公告)日：2016-03-31
申请号：US14792267
申请日：2015-07-06
Applicant: Apple Inc.
Inventor： Dhaval Chandrakant Patel , Jonah A. Harley , Peteris K. Augenbergs , Derryk C. Davis , Scott J. McEuen , John M. Brock
IPC: G06F3/01 , G06F3/0354 , G06F3/041
CPC classification number: G06F3/016 , G06F1/169 , G06F3/03547 , G06F3/041 , G06F3/0414 , G06F2203/04103 , G06F2203/04105 , H01F7/126 , H05K3/325 , H05K2201/10409
Abstract: A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.
Abstract translation: 触觉反馈组件包括用于将触觉致动器机械地和电气地固定在轨道垫组件中的互连，以便安全地并且有效地向用户提供触觉反馈。
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公开(公告)号：US11862688B2
公开(公告)日：2024-01-02
申请号：US17387093
申请日：2021-07-28
Applicant: Apple Inc.
Inventor： Ashish K. Sahoo , Brandon Pierquet , Derryk C. Davis , Javier Ruiz , John M. Brock
IPC: H01L23/14 , H01L29/20 , H01L23/31 , H01L23/36 , H01L23/522 , H01L23/532 , H01L27/088
CPC classification number: H01L29/2003 , H01L23/14 , H01L23/31 , H01L23/36 , H01L23/5226 , H01L23/53228 , H01L27/088
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.
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公开(公告)号：US20190210480A1
公开(公告)日：2019-07-11
申请号：US16357089
申请日：2019-03-18
Applicant: Apple Inc.
Inventor： Jeffrey M. Alves , Zaka Ullah Zahid , Jennifer D. Pollock , Derryk C. Davis , Hunter H. Wu
CPC classification number: B60L53/36 , B60L3/12 , B60L53/12 , B60L53/124 , B60L53/37 , B60L53/39 , B60L53/60 , B60L2240/72 , B60L2260/32 , B60L2260/46 , H02J7/025 , H02J50/10 , H02J50/60 , H02J50/90 , Y02T10/7005 , Y02T10/7072 , Y02T10/7291 , Y02T90/121 , Y02T90/122 , Y02T90/125 , Y02T90/128 , Y02T90/14 , Y02T90/163
Abstract: A system such as a vehicle may have control circuitry that controls a steering and propulsion system. The control circuitry may use the steering and propulsion system to park the vehicle in a parking space. Wireless power may be transferred from a wireless power transmitter in the parking space to a wireless power receiver coupled to a vehicle body in the vehicle. The control circuitry may use sensors to make sensor measurements during parking events. The control circuitry may also gather information on wireless power transfer efficiency. Historical vehicle-to-wireless-power-transmitter alignment information may be updated based on the sensor measurements and corresponding wireless power transfer efficiency measurements and may be used to park the vehicle in an optimal location during subsequent parking events. Vehicle parking position may be intentionally varied over a series of parking events to gather additional alignment information.
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公开(公告)号：US20160162030A1
公开(公告)日：2016-06-09
申请号：US15045628
申请日：2016-02-17
Applicant: Apple Inc.
Inventor： Dhaval Chandrakant Patel , Jonah A. Harley , Peteris K. Augenbergs , Derryk C. Davis , Scott J. McEuen , John M. Brock
CPC classification number: G06F3/016 , G06F1/169 , G06F3/03547 , G06F3/041 , G06F3/0414 , G06F2203/04103 , G06F2203/04105 , H01F7/126 , H05K3/325 , H05K2201/10409
Abstract: A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.
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