-
公开(公告)号：US11424180B2
公开(公告)日：2022-08-23
申请号：US16890624
申请日：2020-06-02
发明人： Jong Sik Paek , Jin Young Kim , YoonJoo Kim , Jin Han Kim , SeungJae Lee , Se Woong Cha , SungKyu Kim , Jae Hun Bae , Dong Jin Kim , Doo Hyun Park
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31 , H01L21/56
摘要： A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.
-
公开(公告)号：US20240363470A1
公开(公告)日：2024-10-31
申请号：US18765853
申请日：2024-07-08
发明人： Yeong Beom Ko , Dong Jin Kim , Se Woong Cha
IPC分类号： H01L23/31 , H01L21/56 , H01L21/78 , H01L23/00 , H01L23/498 , H01L23/538
CPC分类号： H01L23/3185 , H01L21/561 , H01L21/78 , H01L23/3114 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/94 , H01L24/96 , H01L24/97 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04105 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/12105 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/32245 , H01L2224/73209 , H01L2224/73253 , H01L2224/73267 , H01L2224/81005 , H01L2224/92124 , H01L2224/92242 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/1434 , H01L2924/181 , H01L2924/18162
摘要： A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.
-
公开(公告)号：US12033910B2
公开(公告)日：2024-07-09
申请号：US17028329
申请日：2020-09-22
发明人： Yeong Beom Ko , Dong Jin Kim , Se Woong Cha
IPC分类号： H01L23/31 , H01L21/56 , H01L21/78 , H01L23/00 , H01L23/498 , H01L23/538
CPC分类号： H01L23/3185 , H01L21/561 , H01L21/78 , H01L23/3114 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/94 , H01L24/96 , H01L24/97 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04105 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/12105 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/32245 , H01L2224/73209 , H01L2224/73253 , H01L2224/73267 , H01L2224/81005 , H01L2224/92124 , H01L2224/92242 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/1434 , H01L2924/181 , H01L2924/18162 , H01L2224/94 , H01L2224/81 , H01L2224/94 , H01L2224/82 , H01L2224/97 , H01L2224/82 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/83 , H01L2224/131 , H01L2924/014 , H01L2924/00014 , H01L2924/181 , H01L2924/00012
摘要： A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.
-
公开(公告)号：US11508712B2
公开(公告)日：2022-11-22
申请号：US17120991
申请日：2020-12-14
发明人： Dong Jin Kim , Jin Han Kim , Se Woong Cha , Ji Hun Lee , Joon Dong Kim , Yeong Beom Ko
摘要： A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
-
公开(公告)号：US11961867B2
公开(公告)日：2024-04-16
申请号：US17837702
申请日：2022-06-10
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
IPC分类号： H01L27/146 , G06V40/12 , H01L23/00 , H01L23/498 , H01L23/528 , H01L21/56
CPC分类号： H01L27/14636 , H01L23/49811 , H01L23/49827 , H01L23/5286 , H01L24/19 , H01L24/20 , H01L27/14618 , H01L27/14678 , G06V40/12 , H01L21/568 , H01L2224/04105 , H01L2224/211 , H01L2224/214 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H01L2924/181 , H01L2924/00 , H01L2924/12042 , H01L2924/00
摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
-
公开(公告)号：US20230057803A1
公开(公告)日：2023-02-23
申请号：US17891310
申请日：2022-08-19
发明人： Jong Sik Paek , Jin Young Kim , YoonJoo Kim , Jin Han Kim , SeungJae Lee , Se Woong Cha , SungKyu Kim , Jae Hun Bae , Dong Jin Kim , Doo Hyun Park
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31
摘要： A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.
-
公开(公告)号：US20220375985A1
公开(公告)日：2022-11-24
申请号：US17837702
申请日：2022-06-10
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
IPC分类号： H01L27/146 , H01L23/00 , H01L23/498 , H01L23/528
摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
-
公开(公告)号：US20240347575A1
公开(公告)日：2024-10-17
申请号：US18634665
申请日：2024-04-12
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
IPC分类号： H01L27/146 , G06V40/12 , H01L21/56 , H01L23/00 , H01L23/498 , H01L23/528
CPC分类号： H01L27/14636 , H01L23/49811 , H01L23/49827 , H01L23/5286 , H01L24/19 , H01L24/20 , H01L27/14618 , H01L27/14678 , G06V40/12 , H01L21/568 , H01L2224/04105 , H01L2224/211 , H01L2224/214 , H01L2924/12042 , H01L2924/181 , H01L2924/18162
摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
-
公开(公告)号：US11362128B2
公开(公告)日：2022-06-14
申请号：US16907860
申请日：2020-06-22
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
IPC分类号： H01L27/146 , H01L23/00 , H01L23/498 , H01L23/528 , H01L21/56 , G06V40/12
摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
-
公开(公告)号：US20210175222A1
公开(公告)日：2021-06-10
申请号：US17120991
申请日：2020-12-14
发明人： Dong Jin Kim , Jin Han Kim , Se Woong Cha , Ji Hun Lee , Joon Dong Kim , Yeong Beom Ko
摘要： A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.017 秒)
