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公开(公告)号：US11897761B2
公开(公告)日：2024-02-13
申请号：US17832904
申请日：2022-06-06
发明人： Ki Yeul Yang , Kyung Han Ryu , Seok Hun Yun , Bora Baloglu , Hyun Cho , Ramakanth Alapati
CPC分类号： B81C1/00182 , B81B7/007 , B81C1/00158 , B81C1/00301 , H01L23/481 , B81B2201/02
摘要： In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20220415733A1
公开(公告)日：2022-12-29
申请号：US17361686
申请日：2021-06-29
发明人： Kwang Seok Oh , Chang Uk Jang , Jin Seok Ryu , Seung Jae Yu , Weilung Lu , Adrian Arcedera , Seung Mo Kim , Kyung Han Ryu , Yi Seul Han , Woo Jun Kim , Tae Yong Lee
摘要： In one example, an electronic device comprises a cavity substrate comprising a substrate base comprising a top side and a bottom side and a cavity wall over the substrate base and defining a cavity, an electronic component over the substrate base and in the cavity, a lid comprising a top side and a bottom side, wherein the lid is over the substrate base and the cavity wall to define an interior of the cavity and an exterior of the cavity, an adhesive between the bottom side of the lid and a top side of the cavity wall, and a vent seal between the interior of the cavity and the exterior of the cavity. Other examples and related methods are also disclosed herein.
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公开(公告)号：US11948887B2
公开(公告)日：2024-04-02
申请号：US17729770
申请日：2022-04-26
发明人： Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
IPC分类号： H01L23/532 , H01L23/498 , H01L23/538
CPC分类号： H01L23/53238 , H01L23/49816 , H01L23/5385 , H01L23/5386
摘要： Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
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公开(公告)号：US11315875B2
公开(公告)日：2022-04-26
申请号：US16665550
申请日：2019-10-28
发明人： Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
IPC分类号： H01L23/532 , H01L23/498 , H01L23/538
摘要： Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
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公开(公告)号：US20240355739A1
公开(公告)日：2024-10-24
申请号：US18623187
申请日：2024-04-01
发明人： Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
IPC分类号： H01L23/532 , H01L23/498 , H01L23/538
CPC分类号： H01L23/53238 , H01L23/49816 , H01L23/5385 , H01L23/5386
摘要： Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
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公开(公告)号：US20220254726A1
公开(公告)日：2022-08-11
申请号：US17729770
申请日：2022-04-26
发明人： Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
IPC分类号： H01L23/532 , H01L23/498 , H01L23/538
摘要： Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
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