- 专利标题: SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
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申请号: US17729770申请日: 2022-04-26
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公开(公告)号: US20220254726A1公开(公告)日: 2022-08-11
- 发明人: Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
- 申请人: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- 申请人地址: SG Singapore
- 专利权人: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- 当前专利权人: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- 当前专利权人地址: SG Singapore
- 主分类号: H01L23/532
- IPC分类号: H01L23/532 ; H01L23/498 ; H01L23/538
摘要:
Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
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