公开(公告)号：US20160358007A1

公开(公告)日：2016-12-08

申请号：US15144565

申请日：2016-05-02

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: G06K9/00 ,  H01L23/31 ,  H01L23/15 ,  H01L23/00

CPC classification number: H01L23/15 ,  G06K9/00053 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Abstract translation: 指纹传感器装置和制造指纹传感器装置的方法。 作为非限制性示例，本公开的各个方面提供各种指纹传感器装置及其制造方法，其包括互连结构，例如接合线，其至少一部分延伸到用于安装 和/或包括在从该半导体芯片横向偏离的位置处从该半导体管芯向上延伸的互连结构。

公开(公告)号：US20200294875A1

公开(公告)日：2020-09-17

申请号：US16890027

申请日：2020-06-02

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: H01L23/15 ,  H01L23/00 ,  G06K9/00

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US20170338163A1

公开(公告)日：2017-11-23

申请号：US15670589

申请日：2017-08-07

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: H01L23/15 ,  G06K9/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/15 ,  G06K9/00053 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US09984947B2

公开(公告)日：2018-05-29

申请号：US15670589

申请日：2017-08-07

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: G06K9/00 ,  H01L23/15 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L23/15 ,  G06K9/00053 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US10672676B2

公开(公告)日：2020-06-02

申请号：US15988940

申请日：2018-05-24

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: H01L23/15 ,  H01L23/00 ,  G06K9/00 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US20180269121A1

公开(公告)日：2018-09-20

申请号：US15988940

申请日：2018-05-24

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: H01L23/15 ,  H01L23/00 ,  G06K9/00 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

公开(公告)号：US09728476B2

公开(公告)日：2017-08-08

申请号：US15144565

申请日：2016-05-02

Applicant: Amkor Technology, Inc.

Inventor： Ji Young Chung ,  Dong Joo Park ,  Jin Seong Kim ,  Jae Sung Park ,  Se Hwan Hong

IPC: G06K9/00 ,  H01L23/15 ,  H01L23/00 ,  H01L23/498 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/15 ,  G06K9/00053 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.