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公开(公告)号：US20240004016A1
公开(公告)日：2024-01-04
申请号：US17804647
申请日：2022-05-31
发明人： Yannick Vuillermet , Loïc André Messier , Simon E. Rock , Maxwell McNally , Alexander Latham , Andreas P. Friedrich
CPC分类号： G01R35/005 , G01R15/202 , G01R15/207 , G01R33/072
摘要： Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.
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公开(公告)号：US11366141B1
公开(公告)日：2022-06-21
申请号：US17160573
申请日：2021-01-28
摘要： A current sensor includes a lead frame having a plurality of leads, at least two of which form a current conductor configured to carry a current that generates a magnetic field and a substrate having first and second opposing surfaces, the first surface proximate to said current conductor and the second surface distal from the current conductor. A first magnetic field transducer is disposed on the substrate and a first coil is disposed on the substrate adjacent to the first magnetic field transducer, wherein the first magnetic field transducer and the first coil are positioned on a first side of the current conductor. A second magnetic field transducer is disposed on the substrate and a second coil is disposed on the substrate adjacent to the second magnetic field transducer, wherein the second magnetic field transducer and the second coil are positioned on a second side of the current conductor.
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公开(公告)号：US20240027560A1
公开(公告)日：2024-01-25
申请号：US18480573
申请日：2023-10-04
发明人： Yannick Vuillermet , Loïc André Messier , Simon E. Rock , Maxwell McNally , Alexander Latham , Andreas P. Friedrich
CPC分类号： G01R35/005 , G01R15/207 , G01R33/072 , G01R15/202
摘要： Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.
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公开(公告)号：US20230314483A1
公开(公告)日：2023-10-05
申请号：US17657135
申请日：2022-03-30
CPC分类号： G01R15/207 , H01L43/14 , H01L43/065 , H01L43/04
摘要： A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness. A method of manufacturing a current sensor IC includes providing a unitary lead frame sheet having a first thickness, decreasing a thickness of a portion of the sheet to provide a first portion with the first thickness and a second portion with a smaller thickness, and stamping the sheet to form a repeating lead frame pattern, with each pattern including a primary conductor formed from the first portion and secondary leads formed from the second portion.
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公开(公告)号：US20240264248A1
公开(公告)日：2024-08-08
申请号：US18164676
申请日：2023-02-06
摘要： Methods and apparatus for canceling inductive coupling in a magnetic field sensing device having one or more Hall elements. A device can include a Hall element having a first pair of first and second voltage sensing terminals at diametrically opposed locations on the Hall element, and a second pair of third and fourth voltage sensing terminals diametrically opposed locations on the Hall element. A first mirror conductive path extends around a perimeter of the Hall element in a first direction a second mirror conductive path extends around the perimeter of the Hall element in a second direction so that the first and second mirror conductive paths are on opposite sides of the Hall element and are equal and opposite to cancel inductive coupling.
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6.发明授权公开(公告)号：US11567890B2
公开(公告)日：2023-01-31
申请号：US16452804
申请日：2019-06-26
发明人： Wade Bussing , Maxwell McNally
IPC分类号： G06F13/40 , H03K17/687
摘要： In one aspect, an electronic device includes a switching circuit connected to a resistance circuit and ground, the resistance circuit connected to a port and the port configured to be connected in series to an external resistor and a supply voltage. A voltage at the port is a first voltage that is less than the supply voltage if the switching circuit is enabled to be a closed circuit and the voltage at the port is a second voltage that is equal to the supply voltage if the switching circuit is enabled to be an open circuit.
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公开(公告)号：US11885866B2
公开(公告)日：2024-01-30
申请号：US17804647
申请日：2022-05-31
发明人： Yannick Vuillermet , Loïc André Messier , Simon E. Rock , Maxwell McNally , Alexander Latham , Andreas P. Friedrich
CPC分类号： G01R35/005 , G01R15/202 , G01R15/207 , G01R33/072
摘要： Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.
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公开(公告)号：US20240003995A1
公开(公告)日：2024-01-04
申请号：US17810353
申请日：2022-07-01
发明人： Simon E. Rock , Georges El Bacha , Shaun D. Milano , Loïc André Messier , Alexander Latham , Maxwell McNally , Shixi Louis Liu
CPC分类号： G01R33/06 , G01R19/0092 , H05K1/181 , H05K2201/10151
摘要： A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.
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公开(公告)号：US11768230B1
公开(公告)日：2023-09-26
申请号：US17657135
申请日：2022-03-30
CPC分类号： G01R15/207 , H10N52/01 , H10N52/101 , H10N52/80
摘要： A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness. A method of manufacturing a current sensor IC includes providing a unitary lead frame sheet having a first thickness, decreasing a thickness of a portion of the sheet to provide a first portion with the first thickness and a second portion with a smaller thickness, and stamping the sheet to form a repeating lead frame pattern, with each pattern including a primary conductor formed from the first portion and secondary leads formed from the second portion.
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