-
公开(公告)号：US12112865B2
公开(公告)日：2024-10-08
申请号：US17695193
申请日：2022-03-15
CPC分类号： H01B5/02 , G01R19/0092 , H02G5/00
摘要： A system, comprising a bus bar having a first through-hole formed therein and a first current sensor that is disposed adjacent to the first branch. The first through-hole is arranged to define, at least in part, a first branch of the bus bar and a second branch of the bus bar. The first branch has different length and/or thickness than the second branch. The first current sensor is arranged to measure an electrical current through the bus bar.
-
公开(公告)号：US20220283200A1
公开(公告)日：2022-09-08
申请号：US17189480
申请日：2021-03-02
摘要： According to some embodiments, a device includes: a magnetic field current sensor magnetically coupled to a conductor and configured to generate a magnetic field signal having a magnitude responsive to a current flowing through the conductor; a shunt interface having first and second input terminals electrically coupled to ends of a shunt disposed along the conductor, the shunt interface configured to generate a shunt signal having a magnitude responsive to the current flowing through the conductor; and a diagnostic circuit configured to receive the magnetic field signal and the shunt signal and to generate a fault signal based on a comparison between the magnitude of the magnetic field signal and the magnitude of the shunt signal.
-
3.发明申请公开(公告)号：US20200333380A1
公开(公告)日：2020-10-22
申请号：US16385111
申请日：2019-04-16
摘要： A method can use a current sensor that can include a magnetic flux concentrator and a first magnetic field sensing element disposed proximate to the magnetic flux concentrator, the first magnetic field sensing element having a first maximum response axis, the first magnetic field sensing element operable to generate a first signal responsive to a first magnetic field proximate to the first magnetic field sensing element resulting from an electrical current passing through a conductor, wherein the magnetic flux concentrator is operable to influence a direction of the first magnetic field. The current sensor also includes a second magnetic field sensing element disposed proximate to the magnetic flux concentrator, the second magnetic field sensing element having a second maximum response axis, the second magnetic field sensing element operable to generate a second signal responsive to a second magnetic field proximate to the second magnetic field sensing element resulting from the electrical current passing through the conductor, wherein the magnetic flux concentrator is operable to influence a direction of the second magnetic field. The current sensor can also include a differencing circuit operable to subtract the first and second signals to generate a difference signal related to the electrical current.
-
公开(公告)号：US11940470B2
公开(公告)日：2024-03-26
申请号：US17804654
申请日：2022-05-31
CPC分类号： G01R15/207 , H02K11/27 , H02K2211/03
摘要： A substrate, comprising one or more first conductive layers, one or more second conductive layers, and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers. The one or more second conductive layers are electrically coupled to the first conductive layers. The first conductive layers and the second conductive layers are arranged to form a conductor. The first conductive layers are arranged to define a first rift in the conductor.
-
公开(公告)号：US11892476B2
公开(公告)日：2024-02-06
申请号：US17651080
申请日：2022-02-15
发明人： Simon E. Rock , Thomas Kerdraon , Yannick Vuillermet , Loïc André Messier , Andreas P. Friedrich
CPC分类号： G01R15/202 , G01R19/0092
摘要： Current sensor packages are described including a leadframe configured to carry a current to be sensed and a current sensor that is electrically isolated from the leadframe. The current sensor is disposed adjacent to a first portion of the leadframe that includes a plurality of notches. An encapsulating material is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches. The current sensor includes a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate. The first magnetic field sensing element and the second magnetic field sensing element are disposed on opposite sides of a central axis of the first portion of the leadframe.
-
公开(公告)号：US20240027560A1
公开(公告)日：2024-01-25
申请号：US18480573
申请日：2023-10-04
发明人： Yannick Vuillermet , Loïc André Messier , Simon E. Rock , Maxwell McNally , Alexander Latham , Andreas P. Friedrich
CPC分类号： G01R35/005 , G01R15/207 , G01R33/072 , G01R15/202
摘要： Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.
-
公开(公告)号：US11099217B2
公开(公告)日：2021-08-24
申请号：US16385111
申请日：2019-04-16
摘要： A method can use a current sensor that can include a magnetic flux concentrator along with first and second magnetic field sensing elements disposed proximate to the magnetic flux concentrator, wherein the magnetic flux concentrator is operable to influence a direction of first and second magnetic fields at the first and second magnetic field sensing elements, respectively, the first and second magnetic fields resulting from an electrical current passing through a conductor, the first and second magnetic field sensing elements operable to generate first and second signals, respectively, in response to the first and second magnetic fields, respectively, wherein the current sensor can also include a differencing circuit operable to subtract the first and second signals to generate a difference signal related to the electrical current.
-
公开(公告)号：US20240210447A1
公开(公告)日：2024-06-27
申请号：US18434967
申请日：2024-02-07
CPC分类号： G01R15/207 , H02K11/27 , H02K2211/03
摘要： An apparatus, including: one or more first conductive layers; a plurality of second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a rift in the conductor, the rift being formed by using a plurality of through-holes that are situated above or below each other, each of the plurality of through-holes being formed in a different one of the second conductive layers, each of the plurality of through-holes being formed directly above or below a solid portion of at least one of the first conductive layers; and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers.
-
公开(公告)号：US20230417802A1
公开(公告)日：2023-12-28
申请号：US17850152
申请日：2022-06-27
CPC分类号： G01R15/202 , H05K1/0225 , G01R19/0092 , H05K1/18
摘要： A current sensor system includes a current sensor integrated circuit (IC) and a printed circuit board (PCB) having a ground plane with a feature configured to reduce an eddy current. The current sensor IC includes a lead frame comprising a die attach pad and at least one lead, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface, at least one magnetic field sensing element supported by the semiconductor die and configured to sense a current in a proximate primary conductor, and a non-conductive mold material enclosing the semiconductor die and a portion of the at least one lead. The PCB ground plane feature can take various forms such as a hole of a dimension larger than the current sensor IC, elongated cuts, or x-shaped cuts.
-
公开(公告)号：US20230298779A1
公开(公告)日：2023-09-21
申请号：US17695193
申请日：2022-03-15
CPC分类号： H01B5/02 , H02G5/00 , G01R19/0092
摘要： A system, comprising a bus bar having a first through-hole formed therein and a first current sensor that is disposed adjacent to the first branch. The first through-hole is arranged to define, at least in part, a first branch of the bus bar and a second branch of the bus bar. The first branch has different length and/or thickness than the second branch. The first current sensor is arranged to measure an electrical current through the bus bar.
-
-
-
-
-
-
-
-
-
搜索结果
29 条记录 (耗时 0.016 秒)
