公开(公告)号：US11387626B1

公开(公告)日：2022-07-12

申请号：US16599533

申请日：2019-10-11

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr

IPC分类号： H01S3/10 ,  H01S5/062 ,  H01S5/323 ,  H01S5/32 ,  H01S5/40 ,  H01S5/10 ,  H01S5/0687 ,  H01S5/0683 ,  H01S5/12 ,  H01S3/13 ,  H01S5/50 ,  H01S5/026

摘要： A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity N×M coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the N×M coupler and the optical amplifiers can be used to adjust an amount of power output from M−1 ports of the N×M coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.

公开(公告)号：US11353666B2

公开(公告)日：2022-06-07

申请号：US16441775

申请日：2019-06-14

申请人： Acacia Communications, Inc.

发明人： Long Chen ,  Christopher Doerr ,  Li Chen

IPC分类号： G02B6/293 ,  G02B6/12 ,  G02B6/42

摘要： An integrated wavelength division multiplexer is described. The integrated wavelength division multiplexer may include a first waveguide core defining a first propagation axis and configured to guide light of a first wavelength and light of a second wavelength, and a second waveguide core defining a second propagation axis and configured to guide the light of the second wavelength. A first portion of the second propagation axis for which the first waveguide core and second waveguide core may be overlapping is oriented at a non-zero angle relative to the first propagation axis. The first waveguide core and second waveguide core may be configured relative to each other to adiabatically couple the light of the second wavelength between the first and second waveguide cores.

公开(公告)号：US11294061B1

公开(公告)日：2022-04-05

申请号：US16104872

申请日：2018-08-17

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr ,  Long Chen

IPC分类号： G01S17/89 ,  G01S7/481 ,  G01S17/10 ,  G01S17/42 ,  H01S5/00

摘要： An apparatus for scanning a scene comprising a light transmitter including a one-dimensional phased array; wherein the light transmitter is fed by a frequency swept scanning laser; and a light receiver including a one-dimensional phased array; the one-dimensional phased array of the light receiver disposed orthogonally to the one-dimensional phased array of the transmitter; wherein light received by the light receiver is enabled to be interfered with light from the frequency swept scanning laser.

公开(公告)号：US11187517B2

公开(公告)日：2021-11-30

申请号：US16441576

申请日：2019-06-14

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr

IPC分类号： G01B9/02 ,  G01S7/4863 ,  G01S17/89 ,  G01S7/481

摘要： Optical coherent receiver arrays are described. The optical coherent receiver arrays include an integrated array of photodetectors separated by integrated mirrors which may cause interference of received free space optical and local oscillator signals. The mirrors may serve as splitters, helping to align the received signal and local oscillator to cause interference. The photodetectors of the optical coherent receiver array may be electrically coupled in various manners to read out the signals. The optical coherent receiver array may be implemented in an optical coherence tomography (OCT) imaging system in some embodiments.

公开(公告)号：US10964605B1

公开(公告)日：2021-03-30

申请号：US16741089

申请日：2020-01-13

申请人： Acacia Communications, Inc.

发明人： Diedrik Vermeulen ,  Long Chen ,  Christopher Doerr

IPC分类号： H01L21/66 ,  G01M11/00 ,  G02B6/122 ,  G02B6/12 ,  G02B6/34 ,  G02B6/30

摘要： Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

公开(公告)号：US10852492B1

公开(公告)日：2020-12-01

申请号：US14926868

申请日：2015-10-29

申请人： Acacia Communications, Inc.

发明人： Diedrik Vermeulen ,  Christopher Doerr

IPC分类号： G02B6/42 ,  G02B6/125 ,  G02B6/12

摘要： Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

公开(公告)号：US10714894B1

公开(公告)日：2020-07-14

申请号：US15938398

申请日：2018-03-28

申请人： ACACIA COMMUNICATIONS, INC.

发明人： Christopher Doerr ,  Li Chen ,  Long Chen

IPC分类号： H01S5/14 ,  H01S5/062 ,  H01S5/10 ,  H01S5/024 ,  H01S5/30 ,  H01S5/06

摘要： In a first embodiment, an external cavity tunable laser, comprising a silicon photonics circuit comprising one or more resonators having one or more p-i-n junctions; wherein a voltage is applied to one or more of the p-i-n junctions. In a second embodiment, a method of operating an external cavity tunable laser, comprising sweeping out free-carriers from a resonator of the tunable laser by applying a voltage to a p-i-n junction of a waveguide of the resonator.

公开(公告)号：US10578799B2

公开(公告)日：2020-03-03

申请号：US15870468

申请日：2018-01-12

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC分类号： G02B6/12 ,  G02B6/10 ,  G02B6/42

摘要： Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US10268055B1

公开(公告)日：2019-04-23

申请号：US16215717

申请日：2018-12-11

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC分类号： G02F1/01

摘要： A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US10222566B1

公开(公告)日：2019-03-05

申请号：US14991242

申请日：2016-01-08

申请人： Acacia Communications, Inc.

发明人： Christopher Doerr ,  Long Chen

IPC分类号： G02B6/42 ,  G02B6/30

摘要： A photonic integrated circuit (PIC) coupled to a substrate may be aligned with receptacles having guide pin structures configured to receive guide pins attached to a fiber assembly. The receptacles may be affixed to a surface of the substrate and/or the PIC to permit the fiber assembly to be removed during a solder reflow process while maintaining the alignment of the fiber assembly to the PIC when reconnected following the solder reflow process.