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公开(公告)号：US09824965B2
公开(公告)日：2017-11-21
申请号：US15399384
申请日：2017-01-05
发明人： Qian Tao , Boon Keat Tan , Richard Lum Kok Keong
IPC分类号： H01L29/00 , H01L23/522 , H01L29/06 , H01L23/528 , H01L25/065 , H01L23/00
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/5223 , H01L23/5283 , H01L24/13 , H01L24/46 , H01L25/0655 , H01L29/0649 , H01L2224/0401 , H01L2224/04042 , H01L2224/48091 , H01L2224/48132 , H01L2224/48463 , H01L2225/0651 , H01L2225/0652 , H01L2924/00014 , H01L2224/45099
摘要： An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.
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公开(公告)号：US09576891B1
公开(公告)日：2017-02-21
申请号：US14872692
申请日：2015-10-01
发明人： Qian Tao , Richard Lum Kok Keong , Boon Keat Tan
IPC分类号： H01L29/00 , H01L23/522
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/5223 , H01L23/5283 , H01L24/13 , H01L24/46 , H01L25/0655 , H01L29/0649 , H01L2224/0401 , H01L2224/04042 , H01L2224/48091 , H01L2224/48132 , H01L2224/48463 , H01L2225/0651 , H01L2225/0652 , H01L2924/00014 , H01L2224/45099
摘要： An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.
摘要翻译： 一种用于将第一电路的第一信号与所公开的第二电路隔离的隔离装置。 隔离装置可以具有衬底和设置在衬底上的多个金属层。 多个金属层具有最远离衬底设置的最顶层金属层和最靠近衬底形成的第一互连金属层。 第一互连金属层设置在远离基板的第一距离处，而最顶层金属层设置在隔离距离远离最靠近最顶层金属层形成的第一相邻金属层。 最顶层金属层的一部分形成第一板。 第一板被配置为将第一信号从第一电路传输到连接到第二电路但与第一板电隔离的第二板。
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公开(公告)号：US09793203B2
公开(公告)日：2017-10-17
申请号：US14873211
申请日：2015-10-02
发明人： Qian Tao , Richard Lum Kok Keong , Boon Keat Tan
IPC分类号： H01L23/522 , H01L23/31 , H01L29/06
CPC分类号： H01L23/5223 , H01L23/3171 , H01L23/48 , H01L29/0649 , H01L2224/48463 , H01L2224/49107
摘要： An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The isolation device comprises a first plate that is electrically coupled to the first circuit, and a second plate that is electrically coupled to the second circuit. The first plate is configured to transmit the first signal from to a second plate that is electrically isolated from the first plate. The first plate and the second plate is surrounded by an isolation material. The isolation device further comprises at least one trench that extend at least partially through the isolation material in a direction that is substantially perpendicular to the first plate and the second plate. The at least one trench may circumscribe one of the first plate and the second plate.
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公开(公告)号：US20170117217A1
公开(公告)日：2017-04-27
申请号：US15399384
申请日：2017-01-05
发明人： Qian Tao , Boon Keat Tan , Richard Lum Kok Keong
IPC分类号： H01L23/522 , H01L23/00 , H01L25/065 , H01L29/06 , H01L23/528
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/5223 , H01L23/5283 , H01L24/13 , H01L24/46 , H01L25/0655 , H01L29/0649 , H01L2224/0401 , H01L2224/04042 , H01L2224/48091 , H01L2224/48132 , H01L2224/48463 , H01L2225/0651 , H01L2225/0652 , H01L2924/00014 , H01L2224/45099
摘要： An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.
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公开(公告)号：US20170098603A1
公开(公告)日：2017-04-06
申请号：US14873211
申请日：2015-10-02
发明人： Qian Tao , Richard Lum Kok Keong , Boon Keat Tan
IPC分类号： H01L23/522 , H01L29/06 , H01L23/31
CPC分类号： H01L23/5223 , H01L23/3171 , H01L23/48 , H01L29/0649 , H01L2224/48463 , H01L2224/49107
摘要： An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The isolation device comprises a first plate that is electrically coupled to the first circuit, and a second plate that is electrically coupled to the second circuit. The first plate is configured to transmit the first signal from to a second plate that is electrically isolated from the first plate. The first plate and the second plate is surrounded by an isolation material. The isolation device further comprises at least one trench that extend at least partially through the isolation material in a direction that is substantially perpendicular to the first plate and the second plate. The at least one trench may circumscribe one of the first plate and the second plate.
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