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    Alignment sensor and lithographic apparatus
    3.
    发明授权
    Alignment sensor and lithographic apparatus 有权

    公开(公告)号：US09857703B2

    公开(公告)日：2018-01-02

    申请号：US15328194

    申请日：2015-07-07

    Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

    Inventor： Simon Gijsbert Josephus Mathijssen ,  Arie Jeffrey Den Boef ,  Justin Lloyd Kreuzer ,  Patricius Aloysius Jacobus Tinnemans

    IPC: G03B27/54 ,  G03F9/00

    CPC classification number: G03F9/7088 ,  G03F9/7065 ,  G03F9/7069

    Abstract: An alignment sensor for a lithographic apparatus is arranged and constructed to measure an alignment of a movable part of the lithographic apparatus in respect of a stationary part of the lithographic apparatus. The alignment sensor comprises a light source configured to generate a pulse train at a optical wavelength and a pulse repetition frequency, a non-linear optical element, arranged in an optical propagation path of the pulse train, the non-linear optical element configured to transform the pulse train at the optical wavelength into a transformed pulse train in an optical wavelength range, an optical imaging system configured to project the transformed pulse train onto an alignment mark comprising a diffraction grating; a detector to detect a diffraction pattern as diffracted by the diffraction grating, and a data processing device configured to derive alignment data from the detected diffraction pattern as detected by the detector.

    Alignment method
    6.
    发明授权
    Alignment method 有权

    公开(公告)号：US10514620B2

    公开(公告)日：2019-12-24

    申请号：US16315100

    申请日：2017-08-14

    Applicant: ASML NETHERLANDS B.V. ,  ASML HOLDING N.V.

    Inventor： Franciscus Godefridus Casper Bijnen ,  Simon Gijsbert Josephus Mathijssen ,  Vassili Demergis ,  Edo Maria Hulsebos

    IPC: G03F9/00

    Abstract: A method of determining the position of an alignment mark on a substrate, the alignment mark having first and second segment, the method including illuminating the alignment mark with radiation, detecting radiation diffracted by the alignment mark and generating a resulting alignment signal. The alignment signal has a first component received during illumination of the first segment only, a second component received during illumination of the second segment only, and a third component received during simultaneous illumination of both segments. The positions of the segments are determined using the first component, the second component and the third component of the alignment signal.

    Position measuring method of an alignment target
    8.
    发明授权
    Position measuring method of an alignment target 有权

    公开(公告)号：US10416577B2

    公开(公告)日：2019-09-17

    申请号：US15777162

    申请日：2016-11-29

    Applicant: ASML NETHERLANDS B.V. ,  ASML HOLDING N.V.

    Inventor： Ralph Brinkhof ,  Simon Gijsbert Josephus Mathijssen ,  Maikel Robert Goosen ,  Vassili Demergis ,  Bartolomeus Petrus Rijpers

    IPC: G03F7/20 ,  G03F9/00

    Abstract: A method of measuring a position of an alignment target on a substrate using an optical system. The method includes measuring a sub-segmented target by illuminating the sub-segmented target with radiation and detecting radiation diffracted by the sub-segmented target using a detector system to obtain signals containing positional information of the one sub-segmented target. The sub-segmented target has structures arranged periodically in at least a first direction, at least some of the structures including smaller sub-structures, and each sub-segmented target is formed with a positional offset between the structures and the sub-structures that is a combination of both known and unknown components. The signals, together with information on differences between known offsets of the sub-segmented target are used to calculate a measured position of an alignment target which is corrected for the unknown component of the positional offset.

    Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method
    9.
    发明授权
    Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method 有权
    标记位置测量装置和方法，光刻设备和装置制造方法

    公开(公告)号：US09551939B2

    公开(公告)日：2017-01-24

    申请号：US14428565

    申请日：2013-09-23

    Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

    Inventor： Simon Gijsbert Josephus Mathijssen ,  Arie Jeffrey Den Boef ,  Stanley Drazkiewicz ,  Justin Lloyd Kreuzer ,  Gerrit Johannes Nijmeijer

    IPC: G03B27/72 ,  G03F7/20 ,  G01B11/14

    CPC classification number: G03F7/70141 ,  G01B11/14 ,  G03F9/7069 ,  G03F9/7088

    Abstract: An apparatus to measure the position of a mark, the apparatus including an illumination arrangement to direct radiation across a pupil of the apparatus, the illumination arrangement including an illumination source to provide multiple-wavelength radiation of substantially equal polarization and a wave plate to alter the polarization of the radiation in dependency of the wavelength, such that radiation of different polarization is supplied; an objective to direct radiation on the mark using the radiation supplied by the illumination arrangement while scanning the radiation across the mark in a scanning direction; a radiation processing element to process radiation that is diffracted by the mark and received by the objective; and a detection arrangement to detect variation in an intensity of radiation output by the radiation processing element during the scanning and to calculate from the detected variation a position of the mark in at least a first direction of measurement.

    Abstract translation: 一种用于测量标记位置的装置，该装置包括用于将辐射引导到装置的光瞳上的照明装置，所述照明装置包括照明源，以提供基本上相等偏振的多波长辐射和波片，以改变 依赖于波长的辐射的极化，使得提供不同极化的辐射; 使用由照射装置提供的辐射在扫描方向上扫描横过标记的辐射来将辐射引导到标记上的目的; 辐射处理元件，用于处理由所述标记衍射并由所述物镜接收的辐射; 以及检测装置，用于检测在扫描期间由辐射处理元件输出的辐射强度的变化，并且根据检测到的变化来计算至少第一测量方向上的标记的位置。

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