公开(公告)号：US11561480B2

公开(公告)日：2023-01-24

申请号：US16712397

申请日：2019-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Ivo Liebregts ,  Niladri Sen ,  Koen Thuijs ,  Ronaldus Johannes Gysbertus Goossens

IPC: G03F7/20

Abstract: A computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate. Non-correctable error is used to help predict locations where defects are likely to be present, allowing improvements in metrology throughput. In an embodiment, non-correctable error information relates to imaging error due to limitations on, for example, the lens hardware, imaging slit size, and/or other physical characteristics of the lithography system. In an embodiment, non-correctable error information relates to imaging error induced by lens heating effects.

公开(公告)号：US11860548B2

公开(公告)日：2024-01-02

申请号：US17425355

申请日：2020-02-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo Tel ,  Hermanus Adrianus Dillen ,  Marc Jurian Kea ,  Mark John Maslow ,  Koen Thuijs ,  Peter David Engblom ,  Ralph Timotheus Huijgen ,  Daan Maurits Slotboom ,  Johannes Catharinus Hubertus Mulkens

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/7065 ,  G03F7/70525 ,  G03F7/70658

Abstract: A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.

公开(公告)号：US11796920B2

公开(公告)日：2023-10-24

申请号：US17797506

申请日：2021-01-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Hermanus Adrianus Dillen ,  Fan Feng ,  Ronald Van Ittersum ,  Willem Louis Van Mierlo ,  Koen Thuijs

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70525

Abstract: A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.

公开(公告)号：US20200209761A1

公开(公告)日：2020-07-02

申请号：US16712397

申请日：2019-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Ivo LIEBREGTS ,  Niladri Sen ,  Koen Thuijs ,  Ronaldus Johannes Gysbertus Goossens

IPC: G03F7/20

Abstract: A computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate. Non-correctable error is used to help predict locations where defects are likely to be present, allowing improvements in metrology throughput. In an embodiment, non-correctable error information relates to imaging error due to limitations on, for example, the lens hardware, imaging slit size, and/or other physical characteristics of the lithography system. In an embodiment, non-correctable error information relates to imaging error induced by lens heating effects.