公开(公告)号：US20180308740A1

公开(公告)日：2018-10-25

申请号：US15766740

申请日：2016-09-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Satish ACHANTA ,  Tiannan GUAN ,  Raymond Wilhelmus Louis LAFARRE ,  Ilya MALAKHOVSKY ,  Bas Johannes Petrus ROSET ,  Siegfried Alexander TROMP ,  Johannes Petrus Martinus Bernardus VERMEULEN

IPC: H01L21/687 ,  G03F7/20 ,  G03F7/00

CPC classification number: H01L21/68742 ,  G03F7/0002 ,  G03F7/707 ,  G03F7/70708 ,  G03F7/70716 ,  G03F7/70725 ,  G03F7/70733 ,  G03F7/70783 ,  H01L21/683 ,  H01L21/6831 ,  H01L21/687 ,  H01L21/6875

Abstract: A substrate table to support a substrate, the substrate table including a main body, burls extending from the main body and having first upper ends that define a support surface to support the substrate, and support pins having second upper ends. The support pins are movable between a retracted position and an extended position. The support pins are arranged to support the substrate in the extended position. The support pins are arranged to be switched to a first stiffness mode and a second stiffness mode. In the first stiffness mode, the support pins have a first stiffness in a direction parallel to the support surface. In the second stiffness mode, the support pins have a second stiffness in the direction parallel to the support surface. The first stiffness is different from the second stiffness.

公开(公告)号：US20200050117A1

公开(公告)日：2020-02-13

申请号：US16485499

申请日：2018-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Richard Johannes Franciscus VAN HAREN ,  Leon Paul VAN DIJK ,  Ilya MALAKHOVSKY ,  Ronald Henricus Johannes OTTEN

IPC: G03F7/20 ,  G03F9/00

Abstract: A method and control system for determining stress in a substrate. The method includes determining a measured position difference between a measured position of at least one first feature and a measured position of at least one second feature which have been applied on a substrate, and determining local stress in the substrate from the measured position difference.

公开(公告)号：US20220155675A1

公开(公告)日：2022-05-19

申请号：US17433038

申请日：2020-02-25

Applicant: ASML NETHERLANDS B.V.

Inventor： Ilya MALAKHOVSKY ,  Derk Servatius Gertruda BROUNS ,  Joffrey Rene Sylvian CRAQUELIN ,  Edward HAGE ,  Pieter Renaat Maria HENNUS ,  Jan Willem Adriaan OOSTERLING ,  Ludolf POSTMA ,  Marcel Duco SNEL ,  Johannes Charles Adrianus VAN DEN BERG ,  Wouter VAN DER CHIJS ,  Bartel Joris VAN DER VEEK ,  Mike Johannes Antonius VAN KUIJK ,  Marina Antoinetta Leonarda VAN UUM-VAN HERK ,  Henricus Marinus Theodorus WIERSMA

IPC: G03F1/64 ,  G03F7/20 ,  G03F1/24

Abstract: An object handling apparatus for handling a generally planar object, the object handling apparatus including: two support arms, at least one of the two support arms movable relative to another support arm generally in a plane such that the two support arms are operable to grip and hold an object disposed in the plane, wherein each of the support arms includes at least one support pad and at least one aligner, the support pads configured to locally contact a surface of the object and apply a force thereto generally perpendicular to the plane so as to support the object and the at least one aligner configured to locally contact a surface of the object and apply a force thereto generally in the plane so as to grip the object.

公开(公告)号：US20190041758A1

公开(公告)日：2019-02-07

申请号：US16039073

申请日：2018-07-18

Applicant: ASML NETHERLANDS B.V.

Inventor： Leon Paul VAN DIJK ,  Mahdi SADEGHINIA ,  Richard Johannes Franciscus VAN HAREN ,  Ilya MALAKHOVSKY ,  Ronald Henricus Johannes OTTEN

IPC: G03F7/20 ,  G03F1/24 ,  G01L5/00

Abstract: A method for determining a mechanical property of a layer applied to a substrate and associated control system for controlling a lithographic process. The method includes obtaining measured out-of-plane deformation of the substrate, the out-of-plane deformation including deformation normal to a substrate plane defined by, or parallel to, a substrate surface. The measured out-of-plane deformation is fitted to a second order polynomial in two coordinates associated with the substrate plane and the mechanical property (e.g. anisotropic Young's moduli) of the layer is determined based on characteristics of the fitted second order polynomial. The mechanical property of the layer can be used to calibrate an in-plane distortion model of the substrate for predicting in-plane distortion based on the measured out-of-plane deformation.