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公开(公告)号：US11687007B2
公开(公告)日：2023-06-27
申请号：US17423325
申请日：2020-01-09
发明人： Arnaud Hubaux , Johan Franciscus Maria Beckers , Dylan John David Davies , Johan Gertrudis Cornelis Kunnen , Willem Richard Pongers , Ajinkya Ravindra Daware , Chung-Hsun Li , Georgios Tsirogiannis , Hendrik Cornelis Anton Borger , Frederik Eduard De Jong , Juan Manuel Gonzalez Huesca , Andriy Hlod , Maxim Pisarenco
IPC分类号： G03F1/70 , G03F7/30 , G03F7/00 , G06F30/392
CPC分类号： G03F7/70508 , G03F1/70 , G03F7/70616 , G06F30/392 , G05B2219/45028 , G05B2219/45031
摘要： A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.
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公开(公告)号：US10241418B2
公开(公告)日：2019-03-26
申请号：US15527645
申请日：2015-09-21
发明人： Marc Hauptmann , Dylan John David Davies , Paul Janssen , Naoko Tsugama , Richard Joseph Bruls , Kornelis Tijmen Hoekerd , Edwin Johannes Maria Janssen , Petrus Johannes Van Den Oever , Ronald Van Der Wilk , Antonius Hubertus Van Schijndel , Jorge Alberto Vieyra Salas
IPC分类号： G03B27/52 , G03B27/42 , G03F7/20 , G03F1/84 , G01N21/95 , H01L21/66 , G01N21/956 , G01N27/61
摘要： A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.
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3.发明申请公开(公告)号：US20190219929A1
公开(公告)日：2019-07-18
申请号：US16362754
申请日：2019-03-25
发明人： Marc Hauptmann , Dylan John David Davies , Paul Janssen , Naoko Tsugama , Richard Joseph Bruls , Kornelis Tijmen Hoekerd , Edwin Johannes Maria Janssen , Petrus Johannes Van Den Oever , Ronald Van Der Wilk , Antonius Hubertus Van Schijndel , Jorge Alberto Vieyra Salas
CPC分类号： G03F7/70616 , G01N21/9501 , G01N27/61 , G01N2021/95676 , G03F1/84 , G03F7/70508 , G03F7/70783 , H01L22/12 , H01L22/20
摘要： A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high- resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.
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公开(公告)号：US20230333482A1
公开(公告)日：2023-10-19
申请号：US18212334
申请日：2023-06-21
发明人： Arnaud HUBAUX , Johan Franciscus Maria Beckers , Dylan John David Davies , Johan Gertrudis Cornelis Kunnen , Willem Richard Pongers , Ajinkya Ravindra Daware , Chung-Hsun Li , Georgios Tsirogiannis , Hendrik Cornelis Anton Borger , Frederik Eduard De Jong , Juan Manuel Gonzalez Huesca , Andriy Hlod , Maxim Pisarenco
IPC分类号： G03F7/20 , G06F30/392 , G03F1/70
CPC分类号： G03F7/70508 , G06F30/392 , G03F1/70 , G03F7/70616 , G05B2219/45028 , G05B2219/45031
摘要： A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.
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