公开(公告)号：US11333984B2

公开(公告)日：2022-05-17

申请号：US16967794

申请日：2019-02-04

Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

Inventor： Richard Joseph Bruls ,  Ronald Peter Albright ,  Peter Conrad Kochersperger ,  Victor Antonio Perez-Falcon

IPC: G03F7/20 ,  B08B6/00

Abstract: Methods and systems are described for reducing particles in the vicinity of an electrostatic chuck (300) in which a cleaning reticle or substrate (320) is secured to the chuck, the cleaning reticle or substrate having surfaces partially devoid of conductive material so that an electric field from the chuck can pass through to a volume adjacent the substrate to draw particles (360) in the volume to the surface of the substrate. Voltage supplied to the chuck may have an alternating polarity to enhance the attraction of particles to the surface.

公开(公告)号：US11892779B2

公开(公告)日：2024-02-06

申请号：US17772201

申请日：2020-10-21

Applicant: ASML HOLDING N.V.

Inventor： Victor Antonio Perez-Falcon

IPC: G03F7/00 ,  G02B7/18

CPC classification number: G03F7/70891 ,  G02B7/1815 ,  G03F7/7015

Abstract: An optical element and a lithographic apparatus including the optical element. The optical element includes a first member having a curved optical surface and a heat transfer surface, and a second member that comprises at least one recess, the at least one recess sealed against the heat transfer surface to form at least one closed channel between the first member and the second member to allow fluid to flow therethrough for thermal conditioning of the curved optical surface. In an embodiment, one or more regions of the heat transfer surface exposed to the at least one closed channel are positioned along a curved profile similar to that of the curved optical surface.

公开(公告)号：US11048175B2

公开(公告)日：2021-06-29

申请号：US16642927

申请日：2018-07-31

Applicant: ASML Holding N.V.

Inventor： Victor Antonio Perez-Falcon ,  Michael Andrew Chieda

IPC: G03F7/20

Abstract: Methods and systems are described for cleaning a support such as a clamp of a chuck that holds a patterning device or a wafer in a lithographic apparatus. The method includes loading a electrostatic cleaning substrate into a lithographic apparatus. The electrostatic cleaning substrate includes at least one electrode. The method further includes bringing the electrostatic cleaning substrate near to the clamping surface to be cleaned and connecting the electrode to a voltage source. Particles present on the support are then transferred to the electrostatic cleaning substrate.

公开(公告)号：US12174552B2

公开(公告)日：2024-12-24

申请号：US17773004

申请日：2020-10-05

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Victor Antonio Perez-Falcon ,  Marcus Adrianus Van De Kerkhof ,  Daniel Leslie Hall ,  Christopher John Mason ,  Arthur Winfried Eduardus Minnaert ,  Johannes Hubertus Josephina Moors ,  Samir A. Nayfeh

IPC: G03F7/00 ,  H01L21/683 ,  H01L21/687

Abstract: Embodiments herein describe methods, devices, and systems for reducing an electric field at a clamp-reticle interface using an enhanced electrostatic clamp. In particular, the electrostatic clamp includes a clamp body, an electrode layer disposed on a top surface of the clamp body, and a plurality of burls that project from a bottom surface of the clamp body, wherein the electrode layer comprises a plurality of cutouts at predetermined locations that vertically correspond to locations of the plurality of burls at the bottom surface of the clamp body.

公开(公告)号：US11550231B2

公开(公告)日：2023-01-10

申请号：US17418478

申请日：2019-12-12

Applicant: ASML Holding N.V.

Inventor： Jeffrey John Lombardo ,  Ronald Peter Albright ,  Daniel Leslie Hall ,  Victor Antonio Perez-Falcon ,  Andrew Judge

IPC: G03F7/20

Abstract: Methods and systems are described for reducing particulate contaminants on a clamping face of a clamping structure in a lithographic system. A substrate such as a cleaning reticle is pressed against the clamping face. A temperature differential is established between the substrate and the clamping face either before or after clamping occurs to facilitate transfer of particles from the clamping face to the substrate.

公开(公告)号：US11500298B2

公开(公告)日：2022-11-15

申请号：US17415715

申请日：2019-12-12

Applicant: ASML Holding N.V.

Inventor： Eric Justin Monkman ,  Michael Andrew Chieda ,  Stephen Roux ,  Victor Antonio Perez-Falcon

IPC: G03F7/20

Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.