公开(公告)号：US11550231B2

公开(公告)日：2023-01-10

申请号：US17418478

申请日：2019-12-12

Applicant: ASML Holding N.V.

Inventor： Jeffrey John Lombardo ,  Ronald Peter Albright ,  Daniel Leslie Hall ,  Victor Antonio Perez-Falcon ,  Andrew Judge

IPC: G03F7/20

Abstract: Methods and systems are described for reducing particulate contaminants on a clamping face of a clamping structure in a lithographic system. A substrate such as a cleaning reticle is pressed against the clamping face. A temperature differential is established between the substrate and the clamping face either before or after clamping occurs to facilitate transfer of particles from the clamping face to the substrate.

公开(公告)号：US11156928B2

公开(公告)日：2021-10-26

申请号：US16615882

申请日：2018-05-02

Applicant: ASML Holding N.V.

Inventor： Gerrit Johannes Nijmeijer ,  Junqiang Zhou ,  Piotr Jan Meyer ,  Jeffrey John Lombardo ,  Igor Matheus Petronella Aarts

IPC: G03F9/00

Abstract: An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arranged. The first set of patterns is arranged in a first sequence along a first direction. The second set of patterns is arranged in a second sequence along the first direction. The second sequence is different from the first sequence. Each pattern of the array of patterns is different from other patterns of the array of patterns that are adjacent to the each pattern.