公开(公告)号：US20150170888A1

公开(公告)日：2015-06-18

申请号：US14182831

申请日：2014-02-18

Applicant: APPLIED MATERIALS, INC.

Inventor： MARTIN LEE RIKER ,  UDAY PAI ,  WILLIAM FRUCHTERMAN ,  KEITH A. MILLER ,  MUHAMMAD M. RASHEED ,  THANH X. NGUYEN ,  KIRANKUMAR SAVANDAIAH

IPC: H01J37/34

CPC classification number: H01J37/3414 ,  C23C14/3407 ,  H01J37/3411 ,  H01J37/3423 ,  H01J37/3435

Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.

Abstract translation: 本文提供了用于基板处理室的目标组件的实施例。 在一些实施例中，目标组件包括板，其包括包括中心部分和支撑部分的第一侧面; 设置在中心部分上的目标; 形成在所述支撑部中的多个凹部; 以及部分地设置在所述多个凹部中的多个垫。