公开(公告)号：US20220102117A1

公开(公告)日：2022-03-31

申请号：US17032220

申请日：2020-09-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Reyn Tetsuro WAKABAYASHI ,  Carlaton WONG ,  Timothy Joseph FRANKLIN

IPC: H01J37/32 ,  H01L21/67

Abstract: Embodiments of components for use in substrate process chambers are provided herein. In some embodiments, a component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.

公开(公告)号：US20210310122A1

公开(公告)日：2021-10-07

申请号：US16945461

申请日：2020-07-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Timothy Joseph FRANKLIN

IPC: C23C16/455

Abstract: Methods and apparatus for forming holes through a substrate are provided herein. In some embodiments, a method of forming holes in a substrate for use in a process chamber includes: partially forming the plurality of holes in a substrate using a first drill to form a plurality of rough holes through the substrate from a first side of the substrate to an opposite second side of the substrate; positioning the substrate between a second drill and a third drill; using the second drill to finish the plurality of rough holes from the first side of the substrate to a first location at least halfway along the length of each hole of the plurality of rough holes; and using the third drill to finish the plurality of rough holes from the second side of the substrate to at least the first location along the length of each hole of the plurality of rough holes.

公开(公告)号：US20180144907A1

公开(公告)日：2018-05-24

申请号：US15405758

申请日：2017-01-13

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Steven E. BABAYAN ,  Philip Allan KRAUS

IPC: H01J37/32 ,  B05B1/00 ,  B05B1/18 ,  B05B12/10

CPC classification number: H01J37/32449 ,  B05B1/005 ,  B05B1/18 ,  B05B12/10 ,  H01J37/32522 ,  H01J37/32981 ,  H01J2237/3341 ,  H01L21/67069 ,  H01L21/67248

Abstract: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a gas distribution plate and one or more temperature detection assemblies. The gas distribution plate includes a body having a top surface and a bottom surface. The one or more temperature detection assemblies are interfaced with the top surface of the gas distribution plate such that a thermal bond is formed between the gas distribution plate and each of the one or more temperature detection assemblies. Each temperature detection assembly includes a protruded feature and a temperature probe. The protruded feature is interfaced with the top surface of the gas distribution plate such that an axial load is placed on the gas distribution plate along an axis of the protruded feature. The temperature probe is positioned in a body of the protruded feature.

公开(公告)号：US20250112075A1

公开(公告)日：2025-04-03

申请号：US18375339

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Joseph F. SOMMERS ,  Joseph F. BEHNKE ,  Sajad YAZDANI ,  Xue CHANG ,  Kartik RAMASWAMY ,  Tomoaki KOHZU ,  Kyounghwan NA

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by a metal bond layer. The substrate support assembly includes a blocking ring disposed around the metal bond layer.

公开(公告)号：US20230118651A1

公开(公告)日：2023-04-20

申请号：US17823702

申请日：2022-08-31

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Alexander SULYMAN ,  Xue CHANG ,  Kartik RAMASWAMY ,  Steven E. BABAYAN ,  Anwar HUSAIN ,  David COUMOU

IPC: H01J37/32 ,  H01L21/683

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.

公开(公告)号：US20220111467A1

公开(公告)日：2022-04-14

申请号：US17392248

申请日：2021-08-02

Applicant: Applied Materials, Inc.

Inventor： Sumit AGARWAL ,  Timothy Joseph FRANKLIN ,  Joseph F. SOMMERS

IPC: B23K26/382

Abstract: Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

公开(公告)号：US20200343123A1

公开(公告)日：2020-10-29

申请号：US16791875

申请日：2020-02-14

Applicant: Applied Materials, Inc.

Inventor： Zheng John YE ,  Edward HAYWOOD ,  Adam FISCHBACH ,  Timothy Joseph FRANKLIN

IPC: H01L21/683 ,  H01J37/32

Abstract: Embodiments described herein relate to apparatus and methods for substantially reducing an occurrence of radio frequency (RF) coupling through a chucking electrode. The chucking electrode is disposed in an electrostatic chuck positioned on a substrate support. The substrate support is coupled to a process chamber body. An RF source is used to generate a plasma in a process volume adjacent to the substrate support. An impedance matching circuit is disposed between the RF source and the chucking electrode is disposed in the electrostatic chuck. An electrostatic chuck filter is coupled between the chucking electrode and the chucking power source.

公开(公告)号：US20240266152A1

公开(公告)日：2024-08-08

申请号：US18107487

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Michael Andrew STEARNS ,  Alok RANJAN ,  Kartik RAMASWAMY ,  Peng TIAN ,  Timothy Joseph FRANKLIN ,  Chris BLANK ,  Carlaton WONG

IPC: H01J37/32 ,  H01F27/28 ,  H01L21/3065

CPC classification number: H01J37/3266 ,  H01F27/28 ,  H01J37/3211 ,  H01L21/3065 ,  H01J2237/0264 ,  H01J2237/3341 ,  H01J2237/3343

Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. The first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. The power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.

公开(公告)号：US20230170241A1

公开(公告)日：2023-06-01

申请号：US17537141

申请日：2021-11-29

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Xue Yang CHANG ,  Anwar HUSAIN ,  Timothy Joseph FRANKLIN ,  Joseph F. SOMMERS

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/32715 ,  H01J37/3244

Abstract: Porous plugs for gas delivery in substrate supports and substrate supports and substrate processing chambers incorporating same are provided herein. In some embodiments, a porous plug for use in a substrate support includes: a porous central passageway; and a solid outer shell bonded to and surrounding the porous central passageway such that there is no continuous gap between the porous central passageway and the solid outer shell along an entire length of the porous plug, wherein the solid outer shell includes sealing surfaces disposed on ends of the solid outer shell to facilitate forming a seal along the sealing surface and surrounding the porous central passageway. In some embodiments, one or more o-ring retaining grooves can be formed about the outer surface of the solid outer shell.

公开(公告)号：US20220293452A1

公开(公告)日：2022-09-15

申请号：US17688712

申请日：2022-03-07

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Carlaton WONG ,  Rajinder DHINDSA ,  Timothy Joseph FRANKLIN ,  Steven BABAYAN ,  Anwar HUSAIN ,  James Hugh ROGERS ,  Xue Yang CHANG

IPC: H01L21/687 ,  H01L21/683

Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.