公开(公告)号：US20230118651A1

公开(公告)日：2023-04-20

申请号：US17823702

申请日：2022-08-31

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Alexander SULYMAN ,  Xue CHANG ,  Kartik RAMASWAMY ,  Steven E. BABAYAN ,  Anwar HUSAIN ,  David COUMOU

IPC: H01J37/32 ,  H01L21/683

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.

公开(公告)号：US20240412959A1

公开(公告)日：2024-12-12

申请号：US18208174

申请日：2023-06-09

Applicant: Applied Materials, Inc.

Inventor： David PETERSON ,  David COUMOU ,  Chuang-Chia LIN ,  Kelvin CHAN ,  Farzad HOUSHMAND ,  Ping-Hwa HSIEH ,  Kristopher FORD

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.