公开(公告)号：US20240412959A1

公开(公告)日：2024-12-12

申请号：US18208174

申请日：2023-06-09

Applicant: Applied Materials, Inc.

Inventor： David PETERSON ,  David COUMOU ,  Chuang-Chia LIN ,  Kelvin CHAN ,  Farzad HOUSHMAND ,  Ping-Hwa HSIEH ,  Kristopher FORD

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.