公开(公告)号：US20250112075A1

公开(公告)日：2025-04-03

申请号：US18375339

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Joseph F. SOMMERS ,  Joseph F. BEHNKE ,  Sajad YAZDANI ,  Xue CHANG ,  Kartik RAMASWAMY ,  Tomoaki KOHZU ,  Kyounghwan NA

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by a metal bond layer. The substrate support assembly includes a blocking ring disposed around the metal bond layer.

公开(公告)号：US20250096703A1

公开(公告)日：2025-03-20

申请号：US18789634

申请日：2024-07-30

Applicant: Applied Materials, Inc.

Inventor： Sajad YAZDANI ,  Jaeyong CHO ,  Alexander SULYMAN ,  Tomoaki KOHZU ,  Kyounghwan NA

IPC: H02N13/00 ,  C23C16/458

Abstract: Embodiments of electrostatic chucks (ESCs) are provided herein. In some embodiments, an electrostatic chuck includes: a dielectric plate having an upper surface and a plurality of mesas extending from the upper surface to a first height to at least partially define a support surface for the substrate; four backside gas cooling zones disposed in the dielectric plate; four gas channels disposed in the dielectric plate and corresponding to the four backside gas cooling zones, wherein the four gas channels are fluidly independent within the dielectric plate and extend from a lower surface of the dielectric plate to a plurality of cooling gas outlets extending to the upper surface within each corresponding cooling zone; a plurality of seal rings extending from the upper surface of the dielectric plate to the first height and defining the four backside gas cooling zones; and one or more electrodes disposed in the dielectric plate.